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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Automotive PCBs are Bucking the Trend With a Forecast of 12% CAGR from 2022 to 2026
July 17, 2023 | TrendForceEstimated reading time: 2 minutes
TrendForce’s global automotive PCB market outlook report indicates that as over half of the PCB industry's end-use applications are in consumer electronics, the economic downturn has had a more pronounced impact on the PCB industry compared to other components, especially when end-market demand has yet to show a significant recovery. The report further predicts a 5.2% contraction in the global PCB market for 2023, estimating a value of US$79 billion. Despite this downturn, the automotive PCB market presents a countervailing growth trajectory, primarily driven by the continuous rise in global EV penetration and the increasing electrification of vehicles.
TrendForce predicts a 14% annual increase in the automotive PCB market, reaching a value of US$10.5 billion in 2023 and accounting for 13% of the total PCB market—up from 11% last year. By 2026, this figure is expected to grow to US$14.5 billion, increasing its share of the total PCB market to 15%. This growth indicates a projected CAGR of 12% from 2022 to 2026.
EV adoption is a significant growth driver for the automotive PCB market, given average PCB values for a BEV are around 5 to 6 times that of a conventional fuel vehicle. Over half of these PCBs are installed in the BEV's control system, which houses the battery management system connected via a wire harness. Moreover, the growing popularity of automotive lightweighting is leading to a gradual shift toward the use of flexible printed circuits, which will further increase the PCB within the electric control system.
The rise of autonomous driving tech and its growing adoption rate, which means the integration of more cameras, radars, and other electronic devices, is also expected to further boost the automotive PCB sector. Automotive PCBs mostly rely on 4 to 8-layer boards; autonomous driving systems often adopt higher-priced HDI boards, which are triple in price. HDI boards used in light detection and ranging systems—equipped in L3 and more advanced autonomous driving systems—can cost tens of dollars and are a major contributor to the automotive PCB market’s future growth in value.
Looking at the types of PCBs, 4 to 8-layer boards are expected to account for about 40% of the total automotive PCBs by 2023, falling to 32% by 2026. In contrast, the proportion of HDI boards is projected to increase from 15% to 20%, and the proportion of FPC boards from 17% to 20%. Additionally, the percentage of thick copper and RF boards will rise from 8% and 8.8% to 9.5% and 10.8%, respectively, while the proportion of lower-priced single and double-layer boards is predicted to decrease from 11.2% to 7.7%.
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Simon Khesin - Schmoll MaschinenSuggested Items
I-Connect007 Releases The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication
05/13/2026 | I-Connect007As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.