Ansys Helps Accelerate Development of TMYTEK's Next-Gen mmWave Technology for 5G, Satellite Communications
July 17, 2023 | PRNewswireEstimated reading time: 1 minute

Leading mmWave technology developer TMY Technology, Inc. (TMYTEK) uses Ansys simulation software to improve the performance, efficiency, and quality of its antenna-in-package (AiP) designs through rapid design verification. TMYTEK relies on numerous Ansys solvers to improve on its next-generation mmWave technologies for 5G and satellite communications quickly — significantly reducing associated development costs.
AiP technologies integrate complex radio frequency components with their related circuitry into a single chip design — an important development in the miniaturization of the radio systems required for consumer electronics and various mmWave applications supporting 5G networks. However, application complexities and ever-increasing market demands for smaller, more compact electronics require engineers to manage and validate their AiP designs more efficiently to reduce cost and time to market.
TMYTEK relies on Ansys solutions to develop its next-generation mmWave technologies, including its 5G open radio access network (O-RAN), small cell antenna, and satellite communication user terminal electronic steering antenna designs. Ansys helps TMYTEK deliver precise results in rapid AiP performance verification, from fast, predictively accurate thermal results, to parasitic parameter calculations, to process automation.
"Using Ansys, we can offer comprehensive design services to our customers, accelerate R&D and speed time to market," said Su-Wei Chang, founder and president at TMYTEK. "Ansys solutions enable us to comprehensively simulate and measure AiP performance faster — spanning antenna and radio-frequency module parasitic parameters, thermal activity, signal and power integrity, and customized system integration design performance. This results in greater efficiency up and down the development chain, freeing time up for future projects."
"As the demand for novel mmWave solutions continues to grow, AiP design complexity and time-to-market requirements present major challenges for our customers," said John Lee, vice president and general manager of the electronics, semiconductor and optics business unit at Ansys. "Ansys simulation solutions drive the rapid innovation behind these novel mmWave technologies, such as TMYTEK's, shaping the future of 5G antenna design."
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Setting Design Constraints Effectively
07/31/2025 | Stephen V. Chavez, Siemens EDAPCB design requires controlling energy within the medium of a PCB. The manner in which we control the chaos of energy is by implementing and utilizing physical and electrical rules, known as constraints, along with a specific structure and material(s) that make up what is known as the foundation of the design. These rules govern everything within the PCB structure and generally fall into two camps: performance and manufacturability. Setting this foundation correctly is extremely important and the key to success.
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
Ansys 2025 R2 Enables Next-Level Productivity by Leveraging AI, Smart Automation, and Broader On-Demand Capabilities
07/30/2025 | PRNewswireAnsys, now part of Synopsys, announced 2025 R2, featuring new AI-powered capabilities across the portfolio that accelerate simulation and expand accessibility.
Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
07/31/2025 | Matt Stevenson -- Column: Connect the DotsAs HDI technology becomes mainstream in high-speed and miniaturized electronics, understanding the PCB manufacturing process can help PCB design engineers create successful, cost-effective designs using advanced technologies. Designs that incorporate blind and buried vias, boards with space constraints, sensitive signal integrity requirements, or internal heat dissipation concerns are often candidates for HDI technology and usually require sequential lamination to satisfy the requirements.
Target Condition: The 5 Ws of PCB Design Constraints
07/29/2025 | Kelly Dack -- Column: Target ConditionHave you ever sat down to define PCB design constraints and found yourself staring at a settings window with more checkboxes than a tax form? You’re not alone. For many designers—especially those newer to the layout world—the task of setting up design constraints can feel like trying to write a novel in a language you just started learning.