Ansys Helps Accelerate Development of TMYTEK's Next-Gen mmWave Technology for 5G, Satellite Communications
July 17, 2023 | PRNewswireEstimated reading time: 1 minute

Leading mmWave technology developer TMY Technology, Inc. (TMYTEK) uses Ansys simulation software to improve the performance, efficiency, and quality of its antenna-in-package (AiP) designs through rapid design verification. TMYTEK relies on numerous Ansys solvers to improve on its next-generation mmWave technologies for 5G and satellite communications quickly — significantly reducing associated development costs.
AiP technologies integrate complex radio frequency components with their related circuitry into a single chip design — an important development in the miniaturization of the radio systems required for consumer electronics and various mmWave applications supporting 5G networks. However, application complexities and ever-increasing market demands for smaller, more compact electronics require engineers to manage and validate their AiP designs more efficiently to reduce cost and time to market.
TMYTEK relies on Ansys solutions to develop its next-generation mmWave technologies, including its 5G open radio access network (O-RAN), small cell antenna, and satellite communication user terminal electronic steering antenna designs. Ansys helps TMYTEK deliver precise results in rapid AiP performance verification, from fast, predictively accurate thermal results, to parasitic parameter calculations, to process automation.
"Using Ansys, we can offer comprehensive design services to our customers, accelerate R&D and speed time to market," said Su-Wei Chang, founder and president at TMYTEK. "Ansys solutions enable us to comprehensively simulate and measure AiP performance faster — spanning antenna and radio-frequency module parasitic parameters, thermal activity, signal and power integrity, and customized system integration design performance. This results in greater efficiency up and down the development chain, freeing time up for future projects."
"As the demand for novel mmWave solutions continues to grow, AiP design complexity and time-to-market requirements present major challenges for our customers," said John Lee, vice president and general manager of the electronics, semiconductor and optics business unit at Ansys. "Ansys simulation solutions drive the rapid innovation behind these novel mmWave technologies, such as TMYTEK's, shaping the future of 5G antenna design."
Suggested Items
Connect the Dots: Proactive Controlled Impedance
05/29/2025 | Matt Stevenson -- Column: Connect the DotsFrom data centers to smartphones, designers know that the ohms have it. Getting impedance right ensures all-important signal integrity and delivers high-performing boards. Our designers understand the importance of controlled impedance, but not everyone addresses it in their designs. The most common and important controlled impedance types we see include microstrip, stripline, embedded microstrip, and differential pairs.
Polar Brings New Book 'The PCB Designers Guide to... More Secrets of High Speed PCBs' to EIPC Edinburgh
05/27/2025 | Polar InstrumentsPolar's latest book, The PCB Designer's Guide to... More Secrets of High Speed PCBs, will see its European Launch at the EIPC conference in Edinburgh, June 3-4, 2025. More Secrets unveils more of the knowledge that is often missed from theoretical text books to help both new and experienced designers realize the PCBs they “thought” they had designed.
FastlinkPCB Accelerates Global Expansion, Builds Efficient PCB Industry Chain
05/26/2025 | FastlinkPCBFastlinkPCB, a PCB manufacturing and assembly solutions provider, announced that it has completed the layout of subsidiaries in the US, Germany, Switzerland, and Malaysia over the past year, forming a localized service network covering North America, Europe, and Southeast Asia.
Defining the Ideal PCB Design Data Output
05/27/2025 | Stephen V. Chavez, Siemens EDAAt the heart of delivering successful, manufacturable printed circuit boards lies a vital question: What should your design data output package include to best support manufacturing? The answer: It depends. There are many factors to consider regarding the specific category you’re designing for—such as mil/aero, space, medical, and commercial. Other factors that need to be considered are requirements and engineering intent.
Indium to Feature Materials Solutions for Semiconductor Packaging and Assembly at ECTC
05/22/2025 | Indium CorporationIndium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the Electronics Component and Technology Conference (ECTC), taking place May 27-30 in Dallas, Texas.