DEEPX Drives Innovation in the Evolving Edge AI Landscape with its State-of-the-Art AI Chip Product Lineup
July 17, 2023 | PRNewswireEstimated reading time: 2 minutes

DEEPX, a leading AI semiconductor technology company, aims to drive innovation in the rapidly evolving edge AI landscape with its state-of-the-art, low-power, high-performance AI chip product lineup. With a focus on revolutionizing application areas such as smart cities, surveillance, smart factories, and other industries, DEEPX unveiled its latest AI semiconductor solutions at the 2023 Samsung Foundry Forum (SFF), under the theme of "For AI Everywhere."
Recognizing the importance of collaboration and technological partnerships, DEEPX leveraged Samsung Electronics' foundry processes, harnessing the power of 5nm, 14nm, and 28nm technologies for its semiconductor chip designs. As a result, the company has developed a suite of four high-performance, energy-efficient AI semiconductor products: DX-L1, DX-L2, DX-M1, and DX-H1. Each product has been specifically engineered to cater to the unique demands of various market segments, from ultra-compact sensors with minimal data processing requirements to AI-intensive applications such as robotics, computer vision, autonomous vehicles, and many others.
One of the key differentiators of DEEPX's AI chip product line lies in their technological prowess. The chips deliver high-performance AI capabilities while ensuring power efficiency, computational efficiency, AI accuracy, and support for the latest AI algorithms. This technological advantage has propelled DEEPX to the forefront of the AI semiconductor industry, surpassing global competitors' NPU (Neural Processing Unit) technology. Furthermore, DEEPX's AI chips offer superior cost competitiveness compared to GPUs and other market solutions, creating a significant edge in the NPU field.
With a global outlook, the company is actively targeting key markets in the United States, Taiwan, China, and Europe, with a goal to drive adoption and make its technology the preferred choice for Edge AI applications. Through strategic collaborations with industry leaders, including Hyundai-Kia Motors, POSCO DX, Jahwa Electronics, and Coasia Electronics, DEEPX is actively engaged in production verification, further solidifying its position as a leader in the AI semiconductor market.
DEEPX offers comprehensive solutions, including scalable AI chip products, commercial module solutions, reference boards, software development kits (SDKs), and application software packages, empowering customers and contributing to the growth of the domestic and global AI semiconductor ecosystem.
CEO Lokwon Kim expressed his vision for DEEPX's future, stating, "We aspire to lead the global market with our unparalleled core technology while making significant contributions to the growth of Korea's domestic semiconductor ecosystem. Our goal is to maintain technological excellence at the highest global level for the next 10 to 15 years and establish DEEPX as the global standard in the AI semiconductor market."
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
NOVOSENSE, UAES and Innoscience Advance Power Electronics for New Energy Vehicles
10/17/2025 | PRNewswireThe partnership focuses on developing next-generation intelligent integrated Gallium Nitride (GaN) products. Leveraging their combined expertise, the new devices will deliver more reliable GaN driving and protection features, enabling higher power density and paving the way for wider adoption in automotive systems.
Jabil Announces Board Transitions
10/17/2025 | JabilJabil Inc. announced that Executive Chairman of the Board of Directors Mark T. Mondello and Directors Kathleen A. Walters and Jamie Siminoff will not seek re-election at Jabil’s Annual Meeting of Stockholders in January 2026.
StenTech Strengthens Precision Parts Platform with AME Acquisition
10/17/2025 | StenTechStenTech, North America’s leading provider of SMT printing solutions and precision manufacturing, has announced the acquisition of Advanced Metal Etching, Inc. (AME), a recognized specialist in chemically etched and laser cut precision parts.
MKS’ Atotech, ESI to Participate in TPCA Show & IMPACT Conference 2025
10/17/2025 | MKS’ AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 26th TPCA Show 2025 to be held at the Taipei Nangang Exhibition Center from 22-24 October 2025.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.