-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Ventec International, Giga Solutions Forge One-Stop-Shop Cooperative Agreement for PCB Production
July 18, 2023 | Ventec International Group Co., Ltd.Estimated reading time: 2 minutes
Ventec International Group Co., Ltd., has announced a cooperative agreement with UK-based Giga Solutions Ltd. By leveraging Ventec’s purchasing, finance and sales resources, the new ‘Ventec Giga Solutions’ division provides a sustainable, cost-effective platform and organisation to offer full workflow solutions to our PCB and related industry customer base globally. These include factory design, equipment selection, sales, installation, and commissioning.
The agreement lets Ventec Europe and Ventec USA deliver a one-stop-shop for PCB manufacturers, OEMs and manufacturing services companies to establish and expand their PCB manufacturing facilities, leveraging Giga Solutions’ expertise and connections with leading equipment suppliers.
Henceforth trading as Ventec Giga Solutions, the UK-based team is led by Giga Solutions founder Ramesh Dhokia. The new division will offer project management, equipment suitability consulting, sourcing, and sales. Ventec Giga Solutions can also supply bespoke equipment and solutions.
Dhokia has successfully delivered projects for well-known brands and manufacturing organisations, setting up manufacturing of high-quality PCBs. He commented, “This agreement strengthens our ability to conceive and deliver high-quality solutions for our customers, leveraging the complementary technical, logistics and financial resources and supply-chain expertise of the Ventec Group.”
Mark Goodwin, COO EMEA & America at Ventec, said, “The creation of Ventec Giga Solutions expands the range of services Ventec offers to the global PCB manufacturing and related sectors and is expected to bring new customers and provide a solid base for revenue growth going forwards. With this new agreement, we have truly become the industry’s one-stop-shop to serve all our customers’ PCB needs, with the ability to offer customers discrete items through to turn-key packages of materials and process equipment.
The new cooperation builds on Giga Solutions’ 25 years of project experience in setting up production lines to build PCBs for equipment such as smart sensors, smart home devices, mobiles, industrial controls, and complex boards and backplanes for high-speed computing and communications.
Ventec’s range of laminates and prepregs include product lines optimized for superior signal integrity and high-speed digital applications, RF and analog circuits, thermally enhanced materials including insulated metal substrate (IMS) technology, and an advanced range of thermal management solutions. The company also offers a range of distribution materials and consumables and serves customers across the globe, active in industries including automotive, communication, aerospace, and defense.
Additional content from Ventec International Group:
- The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh
- The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art
- The Solutions Guide to... Thermal Management
- Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
- You can also view other titles in our full I-007eBooks library.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Nortech Systems Reports Q1 Results
05/14/2026 | Globe NewswireNortech Systems Incorporated, a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products serving the medical imaging, medical device, industrial, and aerospace & defense markets, reported financial results for the first quarter ended March 31, 2026.
Top Business Groups Urge Congress to Extend, Expand Successful Semiconductor Tax Credit
05/14/2026 | SIAThe Semiconductor Industry Association (SIA) and a broad coalition of 17 other top business and trade groups in a letter urged Congress to extend the Advanced Manufacturing Investment Credit (AMIC) – a highly impactful tax credit for chip production that is set to expire at the end of this year – and expand it to cover semiconductor design and other critical R&D activities.
ONERugged Accelerates Smart Manufacturing with Rugged Computing Solutions
05/14/2026 | BUSINESS WIREAs global manufacturing continues its rapid digital transformation, enterprises are facing increasing pressure to improve production efficiency, strengthen quality control, and enable real-time operational visibility.
Absolute EMS Expands Support for LEO, MEO, and GEO Satellite Programs
05/13/2026 | Absolute EMS, Inc.Absolute EMS, Inc., a Silicon Valley–based provider of high-technology electronics manufacturing services, continues to grow its presence in the satellite sector, supporting programs across low Earth orbit (LEO), medium Earth orbit (MEO), and geostationary orbit (GEO) with advanced PCBA manufacturing, test, and sub-assembly capabilities.
New Courses: Advance Your Electronics Expertise in June and July
05/14/2026 | Global Electronics AssociationStay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.