-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC Community Exclusive: The Ongoing Banking Crisis
July 18, 2023 | Shawn DuBravac, IPCEstimated reading time: 1 minute

On May 1, First Republic Bank became the latest addition to the growing list of failed banks, making it the third major bank to collapse in recent months. Previously the 14th largest bank in the United States, First Republic Bank now holds the unenviable title of being the second largest bank failure in U.S. history. Silicon Valley Bank, which was the 16th largest bank in the country, and Signature Bank, the 29th largest bank in the U.S., also collapsed recently. These two bank failures mark the third and fourth largest bank collapses in history. Since the 1970s, more than 90 banks with assets over $1 billion have failed in the United States. Three of the four largest collapses have occurred in the past few months.
In light of recent U.S. bank failures and a significant surge in interest rates, depositors have hastened withdrawals from commercial banks. Bank deposits have fallen about 3.5%, or over $600 billion, since the start of the year. Small banks have seen deposits decline roughly 4.4%, or nearly $250 billion, since the beginning of the year.
Depositors have been moving bank deposits from low-interest-bearing bank deposits to money market funds which offer higher yields. Money market holdings have risen over $160 billion since the start of the year and are up nearly $400 billion since the Federal Reserve began raising rates in early 2022. The effective Federal Funds rate has risen nearly 500 basis points since the Federal Reserve began raising rates in March 2022. Money market rates have risen sharply over this time while interest rates for savings accounts have remained muted. The spread between interest-bearing bank deposits and money market funds is likely to remain wide and, as a result, deposit outflows are unlikely to reverse.
The outflow of deposits limits both the ability and willingness of banks to offer loans. Moreover, financial institutions are becoming more cautious given both the volatility in the banking system and the broader economic uncertainty. Banks are reporting tighter lending policies and this trend is likely to continue in the months ahead as their risk tolerance continues to diminish.
To read the rest of this article, which appeared in the Summer 2023 issue of IPC Community, click here.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Building Electronics Excellence in India
09/08/2025 | Nolan Johnson, SMT007 MagazineFor over two decades, Dave Bergman has helped steer the Global Electronics Association’s work in India, from a single training course to a thriving regional operation with deep government and industry ties. In this interview, Dave explains how the group went from partnering with IPCA to opening its own office in 2010, creating India’s first domestic electronics manufacturing standard, and securing funding for dozens of Indian companies to attend U.S. trade shows.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
The Global Electronics Association Hosts Successful WorksAsia-AI and Factory of the Future Technical Seminar
09/03/2025 | Global Electronics AssociationOn August 22, 2025, the Global Electronics Association hosted the successful WorksAsia-AI and Factory of the Future Technical Seminar during the exhibition Automation Taipei 2025. The seminar brought together 81 representatives from 58 companies, focusing on the latest applications of AI in smart factories and unveiling four key directions that will drive the electronics industry’s transition toward intelligence and sustainability.
TRI's AI-Powered Inspection Solutions at SMTAI 2025
09/02/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems, will be joining the SMTA International Exposition & Conference. The event will be held from October 21 – 23, 2025, at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.