-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
The July 2023 Issue of PCB007 Magazine Available Now
July 19, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

There are so many exciting dynamics in motion right now in our industry. Recently a prominent industry CEO commented, “Our current market is the most dynamic we’ve seen since the 1970s.” He’s got a point. If returning to continuous improvement practices to increase the operational efficiencies inside your company wasn’t enough motivation, staying competitive in a thriving and changing industry certainly ought to tip the scales toward continuous improvement. In other words, continuous improvement never goes out of style. And it starts with leadership.
In this issue of PCB007 Magazine, we explore how TQM specifically has entered the DNA of continuous improvement disciplines, and the role leadership plays in transformation. If you've ever competed against a TQM company, you understand their winning advantage.
So, how do you start on the journey to modern TQM implementation? A good place to start is with the following interview that we conducted with Chris Chapman, a student of W. Edwards Deming's teachings since 2007: "Data, Analysis, and TQM."
Download your PDF copy for future reference.
Suggested Items
INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation
03/11/2025 | iNEMIThe fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections.
Critical Manufacturing to Show You Might Need a New MES for Making Industry 4.0 A Reality at IPC APEX EXPO 2025
03/10/2025 | Critical ManufacturingCritical Manufacturing, a leader in advanced Manufacturing Execution Systems (MES) and a subsidiary of ASMPT, will show visitors to IPC APEX EXPO 2025 that the company’s MES - complete with extensive features specific to the electronics industry - can serve as a true Industry 4.0 platform. Any electronics manufacturer looking to turn its vision of digital transformation from concept into reality should prioritize visiting Critical Manufacturing at ASMPT SMT Booth 1813.
Gathering Around the EMS Table
03/11/2025 | Mark Wolfe, IPCWhen I entered the EMS provider industry 30 years ago, I attended some early IPC EMS management meetings. While I enjoyed the planned presentations, I especially valued the roundtable discussions with other industry peers. They not only provided an excellent opportunity to foster new relationships but also allowed me to listen to others facing similar challenges, who often addressed them in innovative ways that I could benefit from.
Koh Young Showcases Inspection Innovations at IPC APEX EXPO 2025 in Anaheim, California during March 18-20, 2025
03/10/2025 | Koh YoungKoh Young, the global leader in True3D measurement-based inspection solutions and the exclusive Premier Sponsor of IPC APEX EXPO 2025, invites electronics manufacturers to Booth 2130 for an in-depth look at its cutting-edge inspection technologies. Taking place at the Anaheim Convention Center from March 18–20, 2025, this year’s event highlights Koh Young’s continued advancements in AI-powered process optimization and quality assurance.
European Chips Diversity Alliance Hosts Future Proofing Access to Diverse Talent Event to Strengthen Semiconductor Workforce
03/10/2025 | SEMIThe European Chips Diversity Alliance (ECDA), a European Union-funded initiative coordinated by SEMI Europe, today announced a full-day event on March 27 dedicated to advancing underrepresented groups in the semiconductor industry in collaboration with Learnovate, MIDAS Ireland, and EudaOrg.