Cadence, GlobalFoundries, Hoerzentrum Oldenburg and Leibniz University Hannover Collaborate to Advance Hearing Aid Technology
July 19, 2023 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes

Cadence Design Systems, Inc. announced that it has successfully collaborated with a consortium that included GlobalFoundries (GF), Hoerzentrum Oldenburg gGmbH and Leibniz University Hannover to develop the industry’s first binaural hearing aid system-on-chip (SoC) prototype, which is programmable with high-programming languages and enables customers to create hearing aids that process critical sounds more optimally while simultaneously reducing background noise. The new SoC, called the Smart Hearing Aid Processor (SmartHeAP), is based on the Cadence® Tensilica® Fusion G6 DSP and Tensilica Xtensa® LX7 processor, the Cadence digital full flow and the GF 22FDX® platform. The SmartHeAP project is supported by the German Federal Ministry of Education and Research under grant 16ES0760.
The SmartHeAP SoC prototype provides hearing aid companies with all the components required to create and reprogram hearing devices that improve a wearer’s hearing experience. Some of the key benefits the SmartHeAP SoC prototype provides include:
- Binaural hearing technology: Hearing aids in the right and left ears communicate with one another, enabling a wearer to pick up sounds from the full auditory scene without destroying the binaural cues.
- Improved hearing loss compensation capabilities: Through advanced algorithms, the SoC automatically analyzes the incoming signal and provides adaptive sound amplification that is customized to the wearer’s unique hearing needs.
- High processing capacity with minimal power consumption: Provides the hearing aid wearer with optimal sound quality in real time while conserving power and extending hearing aid battery life.
- Cost Savings: The hearing aid software can be quickly upgraded without replacing the hardware, saving both the wearers and the hearing aid companies money.
- Faster time to market: Hearing aid companies of all sizes can effectively compete in the market due to the ease of use of high-level programming languages, which enable faster innovation cycles.
The Tensilica Fusion G6 DSP was a logical choice for the development of the SmartHeAP SoC because it’s an easy-to-program, multi-purpose DSP that provides low energy consumption, a small footprint, and exceptional out-of-the-box performance. The Tensilica Xtensa LX7 processor is tailored for control-intensive tasks and offers a small footprint, providing added performance, flexibility, and longevity to the design. The Cadence digital full flow enabled a fast path to design closure and better predictability while delivering optimal power, performance and area (PPA). Finally, the GF 22FDX platform provided up to 50% lower power at the same high-performance frequencies (vs. 28nm), enabled by the adaptive body bias (ABB) feature, which is critically important for ultra-low 0.5V VDD or below to reduce power consumption on battery-powered devices, such as hearing aids.
“By collaborating with GF, Hoerzentrum Oldenburg gGmbH and Leibniz University Hannover on the SmartHeAP SoC prototype, our research and technology advancements are improving the hearing experience,” said Rishi Chugh, vice president, product management in the IP Group at Cadence. “Each organization involved brought a unique perspective to the project, and delivering a successful prototype that can make a positive impact on the hearing experience is the ultimate reward. The Cadence digital full flow and Tensilica Fusion G6 DSP and Xtensa LX7 controller were foundational for this project, and the consortium is already seeing a high level of interest in the prototype from the hearing aid industry.”
Suggested Items
Hanon Systems Wins Third PACE Award for Visible-Light LED Photocatalyst Technology
04/18/2025 | PRNewswireHanon Systems, a leading global automotive thermal management supplier and subsidiary of Hankook & Company Group, has been named a winner of the 2025 PACE Awards. This marks the company's third win, making it the first Korean supplier to achieve this recognition.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.
Worldwide Smartphone Market Grew 1.5% in Q1 2025, Amid On-going US-China Trade Tension
04/15/2025 | IDCAccording to preliminary data from the International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker , global smartphone shipments increased 1.5% year-over-year (YoY) to 304.9 million units in the first quarter of 2025 (1Q25).
Saki’s AXI Upgrade Enhances Image Noise Reduction for Power Modules, Enabling Sharper, More Accurate Inspections
04/11/2025 | Saki CorporationSaki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces significant enhancements to the image processing capabilities of its 3Xi-M200 X-ray Automated Inspection (AXI) system.
DuPont Ikonic 9000 CMP Pads Win 2025 Edison Award
04/09/2025 | DuPontDuPont announced that its Ikonic™ 9000 series of polishing pads for chemical mechanical planarization (CMP) was awarded a 2025 Bronze Edison Award™ in the AI-driven advancements category.