Smartphone OLED Adoption to Exceed 50% in 2023
July 19, 2023 | TrendForceEstimated reading time: 2 minutes
TrendForce’s latest report on OLED technology and the market indicates that OLED panels will secure more than 50% market share in the smartphone industry by 2023, thanks to a continuous decrease in costs. However, the OLED penetration rate in other applications like TV, laptop, and tablets is considerably less, standing at under 3%. To boost the market penetration of OLEDs, panel manufacturers must tackle more demanding technical challenges, including improved specifications and the need for effective cost reductions to meet market expectations.
The report highlights the introduction of eLEAP technology by Japan Display Inc. (JDI). For the first time, this technology employs a maskless technique, achieving lower power consumption, higher brightness, and an extended lifespan. Two primary obstacles in high-generation OLED development—RGB evaporation interference and uneven film thickness caused by gravity-induced sag of the Fine Metal Mask (FMM) as it enlarges—are addressed by eLEAP. By resolving these issues, eLEAP bolsters the development of higher-generation panels and increases production efficiency via mass production.
In parallel developments, Visionox showcased its maskless ViP technology at the Society for Information Display’s annual Display Week. The company has successfully reduced the gap between pixels by combining the lithographic isolation of pixels with advanced evaporation technology. Furthermore, when the resolution reaches 800 PPI, the distance between the pixel layers is reduced to 10µm, which increases the opening rate by 31.9%, effectively enhancing the lifespan of the OLED. However, challenges include the need to produce guide pillars for isolation, using line-source evaporation to control the evaporation angle, connecting the cathode and isolation pillars to reduce electrode impedance (auxiliary electrode), and managing yield loss from repeated processes.
TrendForce has identified five advantages that Visionox's ViP technology has five distinct advantages for isolating OLED pixels. First, the manufacturing process can address the color mixing yield issues caused by long-term FMM evaporation. Second, individual pixel electrodes can not only increase overall lifespan but also mitigate losses from leakage currents. Third, pixel density and brightness can be effectively elevated. Fourth, the concurrent production of auxiliary electrodes could facilitate larger OLED applications in the future. Lastly, the technology can overcome the limitations FMM imposes on pixel spacing, thus broadening its applications and aiding future high-generation development.
Recently, several key industry players have announced ambitious plans. Samsung declared an investment plan for its new G8.7 fab, BOE is planning its B16 project, JDI and HKC formed a strategic alliance for new technologies, and Visionox has an aggressive push into OLED technology and its market sectors. These developments are responding not only to Apple's demand for medium-sized applications but also opening up new opportunities for OLED panels in other application markets. By 2025, it is anticipated that with the completion of new high-generation facilities, continued technology development, and lifespan improvement of materials, the market penetration rate of OLED products will be significantly bolstered.
Currently, China’s AMOLED production capacity accounts for 43.7% of the global market, slightly less than the capacity share held by South Korean panel manufacturers. This capacity is divided among 4 to 5 Chinese panel factories. As the current AMOLED capacity is oversupplied and it’s expected that future production capacity will only continue to grow, companies focusing exclusively on OLED production will likely continue to grapple with financial pressures. It remains to be seen whether these companies will adopt a similar collaboration model to JDI and HKC given their varying technical capabilities. Through the development of new technologies and strategic alliances or integrations, they will aim to enhance their overall international competitiveness—a development worth watching over the next 3 to 5 years.
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).