The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
ITW EAE Wins Best Paper of TC1 Technology Conference Presented at Nepcon China 2023
July 24, 2023 | ITW EAEEstimated reading time: Less than a minute
ITW EAE was selected as the winner of the best paper of TC1 Technology Conference by SMTA China East. The paper, “Selective Soldering with High-Performance Lead-Free Solders” was presented at Nepcon China 2023 by Khoh Kar Heong, ITW EAE Sales Engineering Manager.
The paper investigates three commercially available high-performance lead-free solders designed for circuit assemblies that are located under the hood of automobiles or other harsh environments. These solders were compared to the standard lead-free alloy, Sn3.0Ag0.5Cu, for four different through-hole assemblies.
The paper concludes that the major parameters in selective soldering that contribute to good hole filling are all related to wetting. Once the solder temperature and drag speed are optimized, all other factors: flux type, nozzle type, and solder alloy are less critical for hole filling. Solder composition is an issue in selective soldering. This experiment concluded that the Ni and Cu content can be a critical factor for formation of (Cu, Ni)6Sn5 and or Cu6Sn5 needles.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.