-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
APCT Now Offering Full Turnkey Solutions
August 16, 2023 | APCTEstimated reading time: Less than a minute

With the recent acquisition of Advanced Circuits and the subsequent acquisition of San Diego PCB Design, APCT has become the second largest printed circuit manufacturer in North America offering design, fabrication and assembly.
The design team is experienced and has the ability to offer its expertise in a number of design layout services: standard through-hole, high-density interconnect (HDI), signal/power integrity design, dense high-speed digital, and RF and rigid-flex. The IPC certified designers deliver accurate, high-reliability PCB layout designs to hundreds of customers across North America.
The assembly operation is located within the ACI headquarters in Aurora, Colorado. At this time, assembly is viewed as a “value add” to their customer base only. Offerings include both through-hole and surface mount capabilities, supporting prototype quantities of standard technology. All assembly is completed In-House.
Also available to the customer base is kitted/consigned, partial turnkey and full turnkey.
Suggested Items
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/10/2025 | I-Connect007In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.
Showing Some Constraint: Design007 Magazine July 2025
07/10/2025 | I-Connect007 Editorial TeamA robust design constraint strategy balances dozens of electrical and manufacturing trade-offs. This month, we focus on design constraints—the requirements, challenges, and best practices for setting up the right constraint strategy.
Elementary, Mr. Watson: Rein in Your Design Constraints
07/10/2025 | John Watson -- Column: Elementary, Mr. WatsonI remember the long hours spent at the light table, carefully laying down black tape to shape each trace, cutting and aligning pads with surgical precision on sheets of Mylar. I often went home with nicks on my fingers from the X-Acto knives and bits of tape all over me. It was as much an art form as it was an engineering task—tactile and methodical, requiring the patience of a sculptor. A lot has changed in PCB design over the years.
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.