Dan’s Biz Bookshelf: ‘The Future of Sales'
Driving Innovation: Traceability in PCB Production
It’s Only Common Sense: Price—Is That All You’ve Got?
IEC Announces New Partnership with SUSS MicroTec Inc.
August 1, 2023 | IECEstimated reading time: Less than a minute
“It is our great pleasure and privilege to announce our new supply partnership with SUSS MicroTec Inc., effective immediately. Providing exciting and innovative new technology to the solder mask printing process, SUSS MicroTec opens many new doors for IEC to bring streamlined, dynamic systems to the PCB marketplace,” says IEC President Shawn Stone. “SUSS Microtec’s JETxSM and PiXDRO technology not only reduce waste overall, but also bring a new level of speed to production.”
Share on:
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in