Lean vs. TQM vs. Six Sigma
August 2, 2023 | Steve Williams, The Right Approach Consulting LLCEstimated reading time: 1 minute
Introduction
Lean, Total Quality Management (TQM), and Six Sigma are three popular methodologies used in business and manufacturing sectors to improve processes, increase efficiency, and reduce waste. While they share some similarities, each approach has its unique focus and tools. Here's a comparison of Lean, TQM, and Six Sigma.
The Founding Fathers
Companies like Toyota are often touted (with good reason) as the gold standard for quality system models. Toyota’s TPS (Toyota Production System) has been highly publicized and has gained increasing acceptance in American manufacturing operations over the last decade or so. What has not been highly publicized is the fact that many of these concepts originated in America, and quality pioneers like W. Edwards Deming had to take their show on the road to Japan only after being rejected by the leaders of American industry. The contributions of such legends as Dr. Deming, Dr. Joseph Juran, Philip Crosby, Dr. Kaoru Ishikawa, Dr. Walter Shewhart, and Shigeo Shingo had such an impact on the world that they truly are the Founding Fathers of modern quality.
“We strive to decide our own fate. We act with self-reliance, trusting in our own abilities. We accept responsibility for our conduct and for maintaining and improving the skills that enable us to produce added value.”
–Excerpt from Toyota Motor Corporation’s internal document, “Toyota Way”
Lean
Lean is a methodology and philosophy that originated from the Toyota Production System (TPS) and is widely used in various industries for process improvement and waste reduction. The core principle of Lean is to maximize value for customers by minimizing or eliminating non-value-added activities or waste. The primary focus of Lean is on creating flow and eliminating waste throughout the entire value stream, from the beginning of a process to its end. Waste, also known as "Muda" in Lean terminology, refers to any activity or process step that does not add value from the customer's perspective. Figure 1 illustrates the eight types of wastes identified in Lean Manufacturing.
To read this entire article, which appeared in the July 2023 issue of PCB007 Magazine, click here.
Suggested Items
Solar Powered Aircraft Achieves New Stratospheric Success
12/26/2024 | BAE SystemsA British-led team of engineers has taken a leap forward in the race to harness the stratosphere for earth observation and communications, completing a new series of test flights of BAE Systems’ High Altitude Pseudo Satellite (HAPS) Uncrewed Aerial System (UAS), PHASA-35®, in quick succession.
Modernizing TAURUS for the Bundeswehr
12/25/2024 | MBDAThe Bundeswehr and TAURUS Systems GmbH (a joint venture between MBDA and SAAB) have signed a contract for the maintenance and modernization of the TAURUS stand-off weapon system. The measures will ensure the weapon's operational readiness until at least 2045.
SIA Statement on Biden Administration’s Launch of Section 301 Trade Investigation Related to China’s Targeting of the Semiconductor Industry for Dominance
12/25/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding the Biden administration’s decision to launch a Section 301 trade investigation focused on China’s acts, policies, and practices related to targeting of the semiconductor industry for dominance.
Two Additional Boeing O3b mPOWER Satellites Successfully Communicating in Space
12/23/2024 | BoeingTwo more Boeing-built O3b mPOWER satellites are sending and receiving signals in space after launching from the Kennedy Space Center, Florida at 5:26 p.m.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.