Lean vs. TQM vs. Six Sigma
August 2, 2023 | Steve Williams, The Right Approach Consulting LLCEstimated reading time: 1 minute

Introduction
Lean, Total Quality Management (TQM), and Six Sigma are three popular methodologies used in business and manufacturing sectors to improve processes, increase efficiency, and reduce waste. While they share some similarities, each approach has its unique focus and tools. Here's a comparison of Lean, TQM, and Six Sigma.
The Founding Fathers
Companies like Toyota are often touted (with good reason) as the gold standard for quality system models. Toyota’s TPS (Toyota Production System) has been highly publicized and has gained increasing acceptance in American manufacturing operations over the last decade or so. What has not been highly publicized is the fact that many of these concepts originated in America, and quality pioneers like W. Edwards Deming had to take their show on the road to Japan only after being rejected by the leaders of American industry. The contributions of such legends as Dr. Deming, Dr. Joseph Juran, Philip Crosby, Dr. Kaoru Ishikawa, Dr. Walter Shewhart, and Shigeo Shingo had such an impact on the world that they truly are the Founding Fathers of modern quality.
“We strive to decide our own fate. We act with self-reliance, trusting in our own abilities. We accept responsibility for our conduct and for maintaining and improving the skills that enable us to produce added value.”
–Excerpt from Toyota Motor Corporation’s internal document, “Toyota Way”
Lean
Lean is a methodology and philosophy that originated from the Toyota Production System (TPS) and is widely used in various industries for process improvement and waste reduction. The core principle of Lean is to maximize value for customers by minimizing or eliminating non-value-added activities or waste. The primary focus of Lean is on creating flow and eliminating waste throughout the entire value stream, from the beginning of a process to its end. Waste, also known as "Muda" in Lean terminology, refers to any activity or process step that does not add value from the customer's perspective. Figure 1 illustrates the eight types of wastes identified in Lean Manufacturing.
To read this entire article, which appeared in the July 2023 issue of PCB007 Magazine, click here.
Suggested Items
AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030
05/09/2025 | IDTechExBy 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
OSI Systems Receives $36 Million Contract for Aviation Security Systems
05/08/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division received a contract award for approximately $36 million to deploy and service airport screening solutions for a prominent international airport in the Middle East.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.