Marcy’s Musings: Advancing the Advanced Materials Discussion
The Marketing Minute: Cracking the Code of Technical Marketing
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
Chuck Xu, Ph.D. Vice President and General Manager, Interconnect Solutions
August 8, 2023 | DuPontEstimated reading time: 1 minute
Chuck Xu was named Vice President and General Manager (VPGM) for Interconnect Solutions (ICS), a line of business within DuPont Electronics & Industrial (E&I) segment, with $1.8 billion in revenue* focused on being the leading total solutions and systems design partner addressing signal integrity and power transmission challenges, while taking care of our people and our planet.
Before his current position, Chuck served as the VPGM of strategy and mergers & acquisitions (M&A) for E&I. In this role, he led the strategic expansion of the E&I business through the Laird Performance Materials acquisition and the Spectrum Plastics Group acquisition, with a total value of about $4 billion as well as several venture investments.
Prior to that, he was VPGM for DuPont’s Non-Core segment, a $2 billion portfolio of multiple global businesses, and the $1 billion Photovoltaic and Advanced Materials business that offers materials solutions for solar energy, consumer electronics, and industrial segments such as aircraft, automotive and telecom.
Chuck joined DuPont in 2002, holding various global general management positions for DuPont Authentication and Displays businesses. He then moved to Hong Kong as Managing Director and CEO of DuPont Apollo Ltd., a subsidiary manufacturing silicon-based thin film solar modules and systems.
Before joining DuPont, Chuck was the Executive Director of Telephotonics, a telecom startup company, where he successfully led its commercial transformation and acquisition by DuPont in 2002. Earlier in his career, he held progressively challenging leadership roles at Honeywell.
Chuck is a global leader with extensive general management skills, business growth and turnarounds in diverse situations, and M&A experiences. Based in the US, he has been on expatriate assignments in Taiwan and Hong Kong, giving him cross-region and cultural perspectives. His customer-centric approach and proficiency in commercial and technical knowledge have fueled his ability to build enduring customer relationships.
Chuck holds a doctorate in chemistry from the University of Southern California, an MBA from Columbia University, and a bachelor’s degree in chemistry from Peking University.
*Year 2022 revenue
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.