-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current Issue
The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Chuck Xu, Ph.D. Vice President and General Manager, Interconnect Solutions
August 8, 2023 | DuPontEstimated reading time: 1 minute
Chuck Xu was named Vice President and General Manager (VPGM) for Interconnect Solutions (ICS), a line of business within DuPont Electronics & Industrial (E&I) segment, with $1.8 billion in revenue* focused on being the leading total solutions and systems design partner addressing signal integrity and power transmission challenges, while taking care of our people and our planet.
Before his current position, Chuck served as the VPGM of strategy and mergers & acquisitions (M&A) for E&I. In this role, he led the strategic expansion of the E&I business through the Laird Performance Materials acquisition and the Spectrum Plastics Group acquisition, with a total value of about $4 billion as well as several venture investments.
Prior to that, he was VPGM for DuPont’s Non-Core segment, a $2 billion portfolio of multiple global businesses, and the $1 billion Photovoltaic and Advanced Materials business that offers materials solutions for solar energy, consumer electronics, and industrial segments such as aircraft, automotive and telecom.
Chuck joined DuPont in 2002, holding various global general management positions for DuPont Authentication and Displays businesses. He then moved to Hong Kong as Managing Director and CEO of DuPont Apollo Ltd., a subsidiary manufacturing silicon-based thin film solar modules and systems.
Before joining DuPont, Chuck was the Executive Director of Telephotonics, a telecom startup company, where he successfully led its commercial transformation and acquisition by DuPont in 2002. Earlier in his career, he held progressively challenging leadership roles at Honeywell.
Chuck is a global leader with extensive general management skills, business growth and turnarounds in diverse situations, and M&A experiences. Based in the US, he has been on expatriate assignments in Taiwan and Hong Kong, giving him cross-region and cultural perspectives. His customer-centric approach and proficiency in commercial and technical knowledge have fueled his ability to build enduring customer relationships.
Chuck holds a doctorate in chemistry from the University of Southern California, an MBA from Columbia University, and a bachelor’s degree in chemistry from Peking University.
*Year 2022 revenue
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
ITW EAE Despatch Ovens Now Support ASTM 5423 Testing
10/15/2025 | ITW EAEAs the demand for high-performance electrical insulation materials continues to grow—driven by the rapid expansion of electric vehicles (EVs) and energy storage systems—thermal processing has become a critical step in material development.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Creative Materials to Showcase Innovative Functional Inks for Medical Devices at COMPAMED 2025
10/09/2025 | Creative Materials, Inc.Creative Materials, a leading manufacturer of high-performance functional inks and coatings, is pleased to announce its participation in COMPAMED 2025, taking place November 17–20 in Düsseldorf, Germany.
Jiva Leading the Charge Toward Sustainable Innovation
09/30/2025 | Marcy LaRont, PCB007 MagazineEnvironmental sustainability in business—product circularity—is a high priority these days. “Circularity,” the term meant to replace “recycling,” in its simplest definition, describes a full circle life for electronic products and all their elements. The result is re-use or a near-complete reintroduction of the base materials back into the supply chain, leaving very little left for waste. For what cannot be reused productively, the ultimate hope is to have better, less harmful means of disposal and/or materials that can seamlessly and harmlessly decompose and integrate back into the natural environment. That is where Jiva and Soluboard come in.