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Qualcomm Achieves World’s Fastest 5G Downlink with Sub-6 GHz Bands
August 10, 2023 | Qualcomm Technologies, Inc.Estimated reading time: 1 minute
This accomplishment builds upon the launch of Snapdragon X75, the world’s first 5G Advanced-ready modem-RF system, announced in February at MWC Barcelona, and underscores the company’s continued efforts to push the boundaries of 5G performance and flexibility.
Conducted through device testing using a 5G standalone (SA) network configuration, this speed was reached by leveraging a total of 300MHz of spectrum, using 4x carrier aggregation (4xCA) with 4 TDD channels in one downlink connection, and 1024 quadrature amplitude modulation (QAM).
Aggregation of 4 TDD channels enables operators to combine their diverse spectrum assets to achieve higher data rates. In addition, 1024 QAM improves spectral efficiency by incorporating more data into each transmission, in comparison to 256 QAM, ultimately allowing for increased data throughput and improved spectrum efficiency.
These two Snapdragon X75 capabilities, and the modem-RF system’s ten other world firsts, empower better user experiences, faster download speeds, increased network capacity, and improved spectrum efficiency. They enable future-ready devices so more demanding data applications, such as video streaming and downloads, online gaming and more, can run smoother than ever, for more users.
“Snapdragon X75 5G Modem-RF System is the smartest wireless modem we have ever created and is designed for the future, with a 5G Advanced ready architecture, made to help operators define the next generation of networks around the world,” said Sunil Patil, vice president product management, Qualcomm Technologies, Inc. “We look forward to continuing to work with industry leaders to power the best-in-class connectivity experiences and transform industries across consumer, enterprise and industrial use cases.”
Snapdragon X75 is currently sampling to customers, with commercial devices expected to launch in the second half of 2023.
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The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.