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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
November 22, 2024 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
Well, we’re officially entering the silly season, i.e., the holidays. Where did the year go? I still have money left on the Starbuck’s gift card I received last Christmas.
In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Meet Polar's New Engineer Jess Hollenbaugh
Published November 21
Jess Hollenbaugh recently joined Polar Instruments, and she was nice enough to sit down for an interview at PCB West. How did a physics major with a love of thermodynamics wind up in the signal integrity software business? It’s great to see young people coming into our segment again, but we need a few thousand more just like Jess.
Advanced Packaging: Preparation is Now
Published November 20
IPC has just released a white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” written by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer for IPC. This paper fleshes out IPC’s silicon-to-systems concept, and Matt and Devan offer our industry a way forward as we face more complex advance packaging challenges.
Global Citizenship: What I’ve Learned About the American PCB Business
Published November 20
Did you ever wonder what our industry looks like to technologists from other countries? After all, we can be a hot mess, but we still manage to lead the way. And as columnist Tom Yang says, the U.S. PCB industry tends to “double down on innovation.” Check it out.
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Published November 20
Dan Beaulieu writes a weekly column for us, as well as the occasional book review. I’m a big fan of Malcolm Gladwell (Are you a “connector,” a “maven,” or a “salesman”?), so I’ll have to check out Revenge of the Tipping Point: Overstories, Superspreaders, and the Rise of Social Engineering. If you haven’t already done so, read The Tipping Point and Outliers too.
PCB Carolina’s Formula: Industry Experts and Catered Food
Published November 18
Does the food selection at a trade show have any influence on our decision to attend said show? It does for me. I’ve attended PCB Carolina since 2016, and the catered food is always one of the high points of the event. This time we had barbecued brisket for lunch. It’s no wonder PCB Carolina keeps growing every year.
Suggested Items
The Pulse: Ultra Upgrade Unknowns—What’s Coming for UHDI?
01/21/2025 | Martyn Gaudion -- Column: The PulseAs we enter the second quarter of the 21st century, there appears to be a new chapter in PCB technology. Ultra high density interconnect (UHDI) has become a buzzword, but it’s actually not that new; many of the processes were already established in the high-volume production of Asian cell phones and tablets. What is new and challenging, however, is migrating the line widths and stackups—once the domain of handheld consumer products—into the lower volume specialized environment of the commercial world.
Technica USA and Renex Reach Agreement to Distibute REECO Brand of Products
01/21/2025 | Technica USATechnica is pleased to announce that we have entered into an exclusive distribution agreement with Renex for the REECO brand of ESD and cleanroom products. Technica will distribute the REECO products in the territories of California, Oregon, Idaho, Nevada, Arizona, New Mexico, Colorado, and Wyoming, as well as Washington and Utah (non-exclusively).
An Inspiring Journey From Animation to PCB Design
01/20/2025 | Marcy LaRont, I-Connect007I recently spoke with Melissa Martinez, a PCB design student in John Watson’s class at Palomar College. In this interview, Melissa shares her inspiring journey from the world of animation to the realm of printed circuit board design. Introduced to the field by her father, an engineer at Northrop Grumman, she discovered her passion for PCB design through John’s curriculum at Palomar. Her story highlights the importance of mentorship and education in attracting new talent to the industry, encouraging young individuals to explore opportunities they may not yet know exist.
Imagineering, Accutrace Announce Strategic Merger to Enhance Service and Capabilities
01/17/2025 | Newswire.comImagineering Inc., a renowned PCB Fabricator and Assembler, is pleased to announce its merger with Accutrace Inc., a leader in providing time-critical, technologically advanced development and manufacturing services for the electronics industry.
PCB Market Expanding at 3.62% CAGR, To Reach $100 Billion by 2032
01/17/2025 | EINPresswire.comThe global Printed Circuit Board (PCB) Market was valued at US$72.63 billion in 2023 and is projected to exhibit steady growth over the coming years.