-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
American Standard Circuits to Exhibit at European Microwave Week 2023
September 6, 2023 | American Standard CircuitsEstimated reading time: Less than a minute
American Standard Circuits will be exhibiting at this year’s European Microwave Week 2023 to be held at Messe Berlin, Berlin, Germany from September 17th through the 22nd.
Anaya Vardya, President, and CEO of American Standard Circuits commented, “This is always a great show for us since it brings us up to date on Microwave and RF technology as well as providing us an annual glimpse into the European Market. As both our Microwave technology and our European business continue to grow, exhibiting at this even becomes more important.”
The exhibition offers an unrivalled opportunity to view products, technological developments, and form relationships with vendors in the microwave industry. It also offers a forum for discussing trends and exchanging scientific and technical information.
Visit American Standard Circuits on the show floor in booth 418C.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains
04/22/2026 | PRNewswireSilicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles.
Mitate Zepto Technica Joins JST Edge AI Semiconductor R&D Program as Implementation Partner
04/22/2026 | PRNewswireMitate Zepto Technica, Inc., based in Tokyo's Shibuya district, announced on April 20 that it has joined the national research initiative "Next-Generation Edge AI Semiconductor Research and Development Program" promoted by the Japan Science and Technology Agency (JST).
Wearable Technology Market Expected to Reach $183.2 Billion by 2031, Growing at a CAGR of 12.75%
04/22/2026 | PRNewswireAccording to the report, the global wearable technology market size was valued at USD 54.8 billion in 2020 and is projected to reach USD 183.2 billion by 2031, registering a CAGR of 12.75% from 2022 to 2031.
Camtek Acquires Visual Layer to Strengthen Visual AI Capabilities in Inspection and Metrology
04/21/2026 | CamtekCamtek Ltd., a leading developer and manufacturer of inspection and metrology equipment for the semiconductor industry, announced that it has signed a definitive agreement to acquire Visual Layer, a Tel Aviv-based AI company specializing in visual analytics.
Zhen Ding Board Approves Subsidiary Leading Technology’s Hong Kong Listing Plan
04/20/2026 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced (17th) that its Board of Directors has approved a proposal for its subsidiary, Leading Interconnect Semiconductor Technology (Shenzhen) Co., Ltd., to apply for a listing on the Hong Kong Stock Exchange.