-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Latest Advancements in Safety and Reliability Requirements Take Center Stage at IPC’s High Reliability Forum
August 16, 2023 | IPCEstimated reading time: 1 minute

The critical reliability of electronic prosthetics in the brain to help restore movement to a paralyzed hand, enhancing the durability of EV automotive infrastructure, testing criteria and challenges of working with lead-free materials, and evaluation of reliability and maintainability for safe airborne structures are just a few of the agenda items offered at IPC’s High Reliability Forum October 17-19 in Linthicum (Baltimore), Md.
Presentation topics include: safety critical electronics considerations; military, aerospace, medical, automotive, e-Mobility and other applications with specialized reliability requirements; and others related to high reliability issues in PCB design, PCB fabrication materials, PCB assembly, PCBA surface reliability, emerging electronic technologies, mitigation strategies and test methods.
Speakers from the following companies include: Ed Reynolds, John Hopkins University Applied Physics Laboratory (opening keynote); Cynthia A. Chestek, Ph.D., University of Michigan; Raymond Zhao, Ph.D., Northrop Grumman Systems Corporation; Leslie Kim, MacDermid Alpha Electronics Solutions; Brian O’Leary, Indium Corporation; Theresa Campobasso, Exiger; William Capen, Honeywell; and Denis Barbini, Ph.D., Zestron. View complete speaker lineup.
“The event provides a unique opportunity for those in industry who design, manufacture, or test electronics for critical applications with unique safety, reliability, and lifetime requirements to learn about the latest advancements, participate in industry discussions, and network with a respected community of professionals who are all focused on high reliability electronics,” said Bhanu Sood Ph.D., NASA Goddard Space Flight Center, and High Reliability Forum Technical Program co-chair. “And this year, the technical panel is stronger than ever, with well-rounded, industry-curated content focused on electronics with high reliability requirements.”
For more information on the IPC High Reliability Forum including agenda, speaker profiles, exhibition and sponsorship information, or to register for event, visit www.ipc.org/event/high-reliability-forum.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Ecolab to Acquire Ovivo’s Electronics Ultra-Pure Water Business
08/15/2025 | EcolabEcolab Inc. has entered into a definitive agreement to acquire Ovivo’s Electronics business, a leading and fast-growing global provider of breakthrough ultra-pure water technologies for semiconductor manufacturing.
BTU International to Feature Aurora Reflow Technology at SMTA Michigan and Ohio Expos
08/15/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the upcoming SMTA Michigan Expo & Tech Forum on Tuesday, August 19 in Livonia, MI, and the SMTA Ohio Expo & Tech Forum on Thursday, August 21 in Independence, OH.
Kimball Electronics Reports Q4 Results With Solid Finish to the Fiscal Year
08/15/2025 | BUSINESS WIREKimball Electronics, Inc. announced financial results for the fourth quarter and fiscal year ended June 30, 2025.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.
Foxconn Announces Q2 2025 Financial Results
08/15/2025 | FoxconnSecond quarter revenue reached NT$1.79 trillion, with both operating profit and net profit setting record highs for the second-quarter period; earnings per share was NT$3.19 in the April-June period.