VIAVI Introduces NTN, HAPs Network Testing For 5G and 6G Satellite Communication
August 23, 2023 | PRNewswireEstimated reading time: 1 minute

Viavi Solutions Inc. (VIAVI) announced the availability of base station and end-to-end testing supporting Non-Terrestrial Networks (NTN) and High Altitude Platforms (HAPs). Wireless technologies are increasingly augmenting traditional terrestrial communication networks, with satellite communications helping to provide near-complete coverage. The VIAVI TM500 and TeraVM test platforms validate the conformance, performance and reliability of gNodeBs and entire networks under the unique service link conditions of NTN and HAPs networks.
3GPP Release 17 specifications formally introduced support and guidelines for NTNs, with subsequent releases expected to continue to refine the standards. These specifications will help improve the performance of NTNs, allow them to converge with terrestrial telecoms networks and enable support across existing 5G mobile handsets and chipsets. A VIAVI analysis estimated that the growth in satellite communications will result in approximately 30,000 new satellites orbiting the Earth, significantly expanding the potential of NTNs to provide universal coverage.
Satellite communication in 5G brings another level of complexity for testing. NTNs need to be reliable to cope with the distance, speed and mobility of both satellite, HAPs and User Equipment (UE), while still delivering on performance. Test solutions are not only required to emulate different UE mobility and fading profiles, but they must also take the large doppler shifts from fast-moving satellites and airborne platforms into consideration.
To validate the base station prior to non-terrestrial deployment, the TM500 can emulate a high volume of devices, new mobility patterns, signal propagation delays, and other conditions unique to NTN while TeraVM emulates the core network. This test scenario is ideal for early functional tests such as 3GPP protocol testing and can be applied to both regenerative and transparent architectures. Further test scenarios are focused on testing and optimizing the network end-to-end, using a real core to validate the performance and reliability of the entire network.
"NTNs offer new opportunities and partnerships for mobile and satellite operators and the exciting potential to offer connectivity to both underserved and over-populated areas as well as support mission-critical applications," said Ian Langley, Senior Vice President, Wireless Business Unit, VIAVI. "However, amidst the growing interest and race to deploy these networks, it's vital that reliability, stability, and performance testing are done to ensure success."
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Atg Launches Latest Large Format Test System, A9XL, with 8 Heads and 48” x 26” Panel Capability
08/01/2025 | atg Luther & Maelzer GmbHatg Luther & Maelzer GmbH (a Mycronic company) is proud to roll out a new large format test system generation based on the latest high speed atg A9 (board size up to 24” x 21”) and A9L platform.
Magnalytix’s Dr. Mike Bixenman to Guide PDC at SMTA High-Reliability Cleaning and Conformal Coating Conference
07/31/2025 | MAGNALYTIXMagnalytix, providing real-time reliability solutions for electronics manufacturing, is excited to announce that Dr. Mike Bixenman will present the professional development course “The Effects of Flux Residues and Process Contamination on the Reliability of the Electronic Assembly” on Wednesday, Aug. 13 at 9:00 AM CST to open the second day of the STMA High-Reliability Cleaning and Conformal Coating Conference.
TRI to Exhibit at SMTA Queretaro Expo 2025
07/16/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is pleased to announce plans to exhibit at the SMTA Querétaro Expo 2025, scheduled to take place on July 24, 2025, at the Querétaro Centro de Congresos y Teatro Metropolitano.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/16/2025 | I-Connect007In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.