-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Atotech to Participate at KPCA Show 2023 in Seoul, South Korea
August 28, 2023 | AtotechEstimated reading time: 1 minute
MKS’ Atotech will participate at this year’s KPCA Show 2023 in Seoul, South Korea, which will be held at Incheon Songdo Convensia from September 6-8, 2023. MKS will represent its strategic brands, Atotech® and ESI®, and will introduce its latest products and solutions for PCB and package substrate manufacturing, ranging from chemical processes, production systems, auxiliary equipment, and lasers to software solutions for optimized production yield, reliability and efficiency.
All visitors are encouraged to stop by booth G201 and learn about the new solutions:
- G-Plate®: New vertical desmear and electroless HVM plating tool for next-generation high-end package substrates with well-organized particle control
- Geode® A: New CO2 laser system for high precision and high-speed ABF build-up laminate processing
- Printoganth® MV TP3: Ultra-thin electroless copper for advanced SAP manufacturing
- InPro® Pulse TVF: New vertical production solution for high aspect ratio through hole filling with best reliability
- EcoFlash® S300: Differential etching for advanced SAP manufacturing
- Stannatech® 2000: The leading immersion tin process designed to meet future requirements
MKS is highly committed to driving next generation package substrate development working towards meeting 5/5µm L/S targets. By combining leading capabilities in lasers, optics, motion, process chemistry and equipment (horizontal and vertical), we are positioned to Optimize the Interconnect(SM), a significant enabling point of next-generation advanced electronics that represents the next frontier for miniaturization and complexity.
Gucheol Kim, marketing manager of Atotech Korea, said, “Printed circuit boards, package substrates and semiconductor are all key enabler for a modern world and will continue to play an important role as we further progress our journey advancing technical capabilities and with-it electronic products. Today, these mission critical electronic products use components that make innovation possible in various ends, be it 5/6G networks, high-performance computing for server/data centers, self-driving or electric cars, and many more. The requirements for ultra-small, thin, flexible, and high-performing electrical components and the need to provide more sustainable solutions is what keeps us innovating. We understand and strive to satisfy the diverse needs of our customers.”
Conference: KPCA Show 2023
Date: September 6-8, 2023
Booth: G201
Venue: Incheon Songdo Convensia
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.