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Siemens Extends Veloce Hardware-assisted Verification Support of EPGM Ethernet to 1.6 Tbps

12/18/2024 | Siemens
Siemens Digital Industries Software announced today an extension of its Veloce™ hardware-assisted verification platform to support 1.6 Tbps Ethernet. As a core component of the Siemens software/hardware and system validation platform, Veloce delivers complete virtual models to support Ethernet Packet Generator and Monitor (EPGM) Ethernet port speeds up to 1.6 Tbps.

Standard of Excellence: Finding and Developing Future Leaders in Manufacturing

12/17/2024 | Anaya Vardya -- Column: Standard of Excellence
This is the last installment of my three columns on finding, hiring, and keeping key people in the manufacturing industry. This column looks at hiring and nurturing new employees and showing them how working in manufacturing can be a challenging but productive and exciting career. Finding the right people is only half the battle. The other challenge lies in developing their skills and preparing them for leadership, which ensures that your company remains competitive and creates a sustainable pipeline of talent ready to take on tomorrow’s challenges.

Taiwanese PCB Industry Witnessed Steady Growth of 9.6% in Q3 2024

12/12/2024 | TPCA
The global output value of Taiwanese circuit board enterprises demonstrated steady growth in the third quarter of 2024, reaching NT$227.1 billion, a year-over-year increase of 9.6%.

STMicroelectronics to Boost AI at the Edge with New NPU-Accelerated STM32 Microcontrollers

12/11/2024 | STMicroelectronics
STMicroelectronics, is making embedded artificial intelligence (AI) truly here-to-help with a new microcontroller series integrating, for the first time, accelerated machine-learning (ML) capabilities.

Fresh PCB Concepts: PCB Plating Process Overview

12/12/2024 | Team NCAB -- Column: Fresh PCB Concepts
In this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.
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