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Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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IPC Day Comes to Romania
September 1, 2023 | Peter Tranitz, IPCEstimated reading time: Less than a minute
When IPC staff wanted to showcase the latest industry developments to a European audience, they made an obvious choice: Timisoara, Romania.
The dramatic economic expansion here over the past 30 years has resulted in a large concentration of manufacturing and technology businesses. Long-term planning by authorities positioned the city as a business-friendly and diverse cultural hub on the western border, providing easy access to Central Europe.
Timi?oara has now become one of the country’s main economic centres, and in 2023 was the European Capital of Culture.
Today the vast manufacturing infrastructure and skilled workforce here act as a magnet for nearshoring or regionalization investment, where goods are produced close to their end market. According to a Reuters report, “A generational shift in sourcing strategy,” 8.5% of European manufacturers and retailers point to Romania as their future manufacturing location.
The Flex Factor
IPC has had a long-standing relationship with FLEX, a U.S.-headquartered multinational and diversified manufacturing company with a significant presence in Timisoara.
To read the rest of this article, which appeared in the summer issue of IPC Community, click here.
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