Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Achieve Optimal Uniformity with BTU’s TrueFlat Technology at SEMICON Taiwan
September 4, 2023 | BTU International, Inc.Estimated reading time: Less than a minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will highlight its TrueFlat™ reflow oven technology at SEMICON Taiwan in booth #M1039. The expo is scheduled to take place September 6-8, 2023 at TaiNEX 1 & 2 in Taipei.
“Very thin substrates represent a special challenge for thermal processing,” said Joe Yang, product manager at BTU. “Our TrueFlat technology ensures that even substrates as thin as 0.15 mm are kept flat throughout the entire reflow process.”
Part of the industry-leading Pyramax reflow oven platform, TrueFlat technology addresses the critical challenge of substrate warpage. One of the standout features of the TrueFlat is its exceptional thermal uniformity, made possible by integrating the Pyramax’s closed-loop convection heating system. By eliminating die tilt and accommodating substrate thicknesses ranging from 0.15-0.30 mm, TrueFlat technology maximizes process yield.
Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary Wincon™ Windows-based software including factory host/MES interface for Industry 4.0 compliance. This innovative configuration enables manufacturers to achieve reliable and optimal results across a range of applications.
Share on:
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).