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Suggested Items

Is China Plus One Still Happening in the PCB Industry?

04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.
For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.

Lockheed Martin Opens Rapid Fielding Center, Accelerating Defense Innovation and Production

04/06/2026 | Lockheed Martin
Lockheed Martin opened its Rapid Fielding Center, a facility that streamlines the end-to-end development, testing and prototype production of next-generation systems and solutions for U.S. government customers.

Tower Semiconductor to Expand 300mm Capacity in Japan

03/26/2026 | Tower Semiconductor
Tower Semiconductor, the leading foundry for high-value analog semiconductor solutions, announced a strategic restructuring of its Japan operations, which are currently organized under TPSCo (a Japanese company held 51% by Tower and 49% by Nuvoton Technology Corporation Japan (NTCJ).

Lockheed Martin’s NGC2 Prototype Powers Live-Fire Mission Success at Lightning Surge 2

02/27/2026 | Lockheed Martin
During a live fires exercise at Lightning Surge 2, working in close collaboration with the U.S. Army’s 25th Infantry Division (25ID) and Capability Program Executive Command and Control Information Network (CPE C2IN), the Lockheed Martin Team successfully demonstrated how their Next Generation Command and Control (NGC2) prototype enables soldiers to sense, see and strike at distance across echelons. 

Real Time with... APEX EXPO 2026: Remtec Expands Microelectronics Assembly

02/25/2026 | Real Time with... APEX EXPO
Julio Castillo and Chris Dougherty from Remtec discuss their expanded capabilities in microelectronic assembly, including chip and wire and multi-chip module component attachment. They highlight their expertise in ceramic substrates for high-reliability, high-power, and harsh environment applications, offering integrated solutions.
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