Flexible Thinking: The Simplest Way Is the Best Way
Tim’s Takeaways: Human Ingenuity and the Rigid-flex PCBMKS’ Atotech to Participate in IPCA Expo 2023
September 14, 2023 | MKS’ AtotechEstimated reading time: Less than a minute
MKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
At booth EF 51 Atotech® product experts will be introducing the combination of wet chemical processes, production equipment (plating lines, lasers, auxiliaries) and software solutions. A spotlight is set on the various solutions available for e-mobility e.g. BEV, HEV and PHEV batteries and other components. This year highlights include:
- V-Plate®: Vertical continuous Cu plating technology of choice for advanced HDI & IC substrate
- GeodeTM: High-precision CO2 via drilling for HDI PCB manufacturing and IC packaging
- CapstoneTM: Flex PCB UV drilling tool for high-performance breakthrough productivity
- CupraEtch® DF 8000: Low etch rate and etch depth dry film pretreatment
- Noviganth® AF 76: High build self-accelerating electroless copper
- OS Tech® SIT 2: The OSP solution combinable with ENIG
- Stannopure® PF 10: High-speed green tin process for lead frames and connectors
- InPro® MVF 2: Next-generation blind micro via filling in VCP for HDI production
Share on:
Suggested Items
Shortage of Raw Materials Challenges CCL Market Amidst Strong Demand for Electronic Devices
11/13/2023 | Global NewswireThe "Global Copper Clad Laminates Market (by Type, Application, Reinforcement Material, & Region): Insights and Forecast with Potential Impact of COVID-19 (2023-2028)" report has been added to ResearchAndMarkets.com's offering.
SCHMID Group to Exhibit at productronica
11/07/2023 | SCHMID GroupThe SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, will be exhibiting at productronica in Munich from November 14 – 17, 2023.
Financial Risks of Ignoring Copper Grain
11/01/2023 | Alex Stepinski, Stepinski GroupThe topic of intrinsic copper structure has been largely neglected in discussions regarding the PCB fabrication quality control process. At face value, this seems especially strange considering that copper has been the primary conductor in all wiring boards and substrates since they were first invented. IPC and other standards almost exclusively address copper thickness with some mild attention being paid to surface structure for signal loss-mitigation/coarse properties.
Advanced Materials Update with John Andresakis
10/26/2023 | Andy Shaughnessy, Design007At PCB West, I sat down for an interview with John Andresakis, the director of business development for Quantic Ohmega. I asked John to update us on the company’s newest materials, trends in advanced materials, and the integration of Ticer Technologies, which Quantic acquired in 2021. As John explains, much of the excitement in materials focuses on laminates with lower and lower dielectric constants.
Material Insight: The Material Science of PCB Thermal Reliability
10/25/2023 | Preeya Kuray -- Column: Material InsightPrinted circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.
Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in