Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Technica Installs CBT/MLI Direct Imaging System at Summit Interconnect Santa Clara

01/14/2025 | Technica USA
Technica has recently installed the 6th CBT/MLI Direct Imaging (DI) system at Summit Interconnect's Santa Clara operation, a testament to Summit's ongoing commitment to cutting-edge technology and operational excellence.

TSK Schill GmbH Closes 2024 With a Record Turnover

01/14/2025 | TSK Schill GmbH
At TSK, the course continues to be set for growth. Despite the turbulent market development, we were able to increase our turnover “EBIT”. We generated a large proportion of our turnover with Solution Business.

Revolutionizing PCB Testing: RoBAT's Journey from S1 to SCARA

01/07/2025 | Marcy LaRont, PCB007 Magazine
From the early days of simple continuity testers to the advanced SCARA machines, RoBAT's evolution in time-domain reflectometer (TDR) and test technology is a testament to the company's commitment to excellence and adaptation in a rapidly changing industry. In this discussion, RoBAT’s Bruce Nockton discusses the journey, challenges, and importance of automating testing solutions, and highlights how RoBAT has become a frontrunner in delivering high-precision testing equipment, setting new standards for the industry.

Revolutionizing Inner Layer Registration

12/26/2024 | Marcy LaRont, I-Connect007
In this interview with Anthony (Tony) Faraci, founder and president of DIS, we delve into enhancing inner layer accuracy and yields, pivotal to boosting profitability in the circuit board industry. Tony has extensive experience in the development of tooling technology over the decades, which ultimately led to his founding DIS. From his beginnings at Multiline to tackling the challenges of registration accuracy, Tony's insights clearly lay out the complexities of modern manufacturing and the innovations in shaping the future of inner layer registration.

Beyond Design: AI-driven Inverse Stackup Optimization

12/26/2024 | Barry Olney -- Column: Beyond Design
Artificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in