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Technica USA Announces New Strategic Partnership with I.T.C. Intercircuit Production GmbH
June 24, 2025 | Technica USAEstimated reading time: 1 minute
Technica USA is pleased to announce a new distribution and representative agreement with I.T.C. Intercircuit Production GmbH, a globally recognized manufacturer of advanced equipment for the PCB manufacturing industry.
Under this agreement, Technica USA will represent I.T.C. across a broad U.S. territory that includes: California, Nevada, Oregon, Washington, Idaho, Montana, Wyoming, Utah, Colorado, Arizona, New Mexico, Illinois, Indiana, Ohio, Wisconsin, Michigan, Minnesota, Iowa, North Dakota, South Dakota, Kansas, Nebraska, Oklahoma, Texas, Arkansas, Missouri, Louisiana, Mississippi, and Kentucky.
Jason Perry, President of Technica USA, commented on the partnership, “We are very pleased to have the opportunity to add I.T.C. to the quality lines we currently offer to the PCB manufacturing market. I.T.C. manufactures cutting-edge equipment such as Hole Plugging Machines, Manual Grinding Machines, Spray Coating Machines and a variety of ovens. Their technology and innovation make them a valuable addition to our portfolio.”
Technica operates from two spare parts locations with its corporate office and Equipment Demo & Training Center in San Jose, CA, with their second facility in Rancho Cucamonga, CA.
Christian List, Head of Sales for North America and Plant Manager at I.T.C., stated, “We are very excited to renew our relationship with Technica. They represented I.T.C. with distinction in the past, and we are confident that this renewed partnership will drive success for both companies, and most importantly, for the customers we collectively serve.”
Perry added, “Even after 40 years in business, Technica continues to execute the strategic vision laid out by our parent company, Elite Materials Company LLC. We’re expanding as a major distributor and service provider across multiple markets. The alignment between Technica’s and I.T.C.’s goals makes this partnership an ideal match, and we are excited about the future we are building together.”
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Sweeney Ng - CEE PCBSuggested Items
Global Electronics Association to Testify at USMCA Public Hearing; Industry Expert Chris Mitchell Available for Interviews
12/02/2025 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the United States-Mexico-Canada Agreement (USMCA) Review Hearing on Thursday, December 4, outlining the electronics industry’s priorities for strengthening North America’s competitiveness and supply-chain resilience.
Power Integrity: Effective Decoupling Radius
11/26/2025 | Kirk Fabbri, Siemens EDAPower delivery on modern systems is an important and challenging problem facing hardware designers. These challenges are even more apparent as device operating speeds and current demands increase. Modern FPGAs, processors, and other devices feature fast switching currents and demand precise voltage levels.
Advances in Conformal Coating Materials and Methods
11/19/2025 | Saskia Hogan, MacDermid Alpha Electronics SolutionsHigh-performance electronics must endure everything from rain, dust, and oil to extreme temperatures, shock, and vibration. These reliability demands now share the stage with other priorities such as size reduction, lightweighting, and environmental sustainability. Combined with constant pressure to cut costs, accelerate production, and boost manufacturing efficiency, material suppliers are racing to develop advanced conformal coatings that deliver it all: compatibility with finer-pitch circuitry, durability, eco-friendliness, and manufacturing efficiency.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Interposers, Substrates, and Advanced Manufacturing
10/13/2025 | Marcy LaRont, I-Connect007I attend a lot of industry trade shows and conferences. Lately, during conversations with technologists, I’ve noticed that there is some confusion about what exactly constitutes an interposer. One question I hear every so often is, “Are all interposers substrates?” The short answer to that question is no. But some interposers are, in fact, full substrates.