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Peters' New Machine Ensures High Quality
September 14, 2023 | PetersEstimated reading time: 2 minutes
For Peters, the new Reflow 1.8. soldering machine from SEHO is an investment in the future. Like its predecessor, this machine is used in the laboratory for testing high-quality solder resists. Before the coatings are entrusted to the customers, Peters performs a thermal soldering simulation.
Substrates and circuit boards coated with Peters coatings pass through the inner workings of the machine via a conveyor belt. "There, the circuit boards are exposed to temperature stress", reports Jonas Sutmann. Together with his colleague Michael Contzen, the coatings lab technician is responsible for the machine at Peters. "If our coatings withstand this test undamaged under extreme temperature stress, the industrial customer can be sure that in their context, too, they are resistant and robust in view of permanently protecting the respective PCB," reports the 26-year-old technician from Oberhausen.
The coated part can be heated to a maximum of 320° Celsius in the new reflow system by a total of ten radiators on two levels. "If the coating shows no cracks or color changes in the inhouse soldering system after the heat bath, a major hurdle in the development of new special coating systems for electronics has been taken." This ensures the customer that the coating systems from Peters fulfill the high demands placed on them at all times.
The machine is therefore an important element in the development of solder resist technology. Peters is a leader in this field. "Our white solder resist systems from the ELPEPCB® product family are chosen for many LED lamps," reports Detlef Paschke, Head of the Technical Service at Peters. By deciding to purchase the soldering system from SEHO, the full-range supplier of coating materials for electronics from the Lower Rhine region has once again invested significantly in the family-owned company based in Kempen.
By this soldering machine, not only inhouse the research and development activities, but also the Quality Assurance sector is advancing into new dimensions that are directly adapted to the customer’s needs. "This system is indeed a further development of extraordinary value for our research and development," emphasizes Detlef Paschke who has been working at Peters for 27 years. The investment in the reflow system was consistent and future-oriented," says the 54-year-old from Willich.
In the Peters laboratory, the 900-kilogram SEHO machine measuring 3.20 by 1.25 by 1.60 meters is already a hunk in terms of length, height and width. "Nevertheless, our supplier SEHO has built the system in such a way that it takes up around half as much space as in everyday industrial production," says Jonas Sutmann, the responsible machine operator.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/13/2024 | Marcy LaRont, PCB007 MagazineAt the top of my list is “Silicon to Systems,” an interview with technology experts from IPC: Matt Kelly, Devan Iyer, and Kris Moyer. Also, this week, we hear from I-Connect007 Managing Editor Nolan Johnson, who’s been in Mexico for SMTA Guadalajara. Speaking of Mexico, I want to highlight an interview that appeared in IPC Community between Lorena Villanueva and Barjouth Aguilar of Flex, who talk about the importance of sustainability. I wrap up my recommendations with articles about solder printing and wet process control.
Making Waves With Solder Paste Jetting
09/11/2024 | Josh Casper, Horizon SalesAs electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.
Scrutinizing Solder Printing
09/10/2024 | Nolan Johnson, I-Connect007As members of the technical staff at Indium, Adam Murling, technical manager, and Ron Lasky, senior technologist and professor at Dartmouth University, know their way around metallurgy and solder formulation. I corralled them for a conversation on solder application techniques from the solder’s perspective and their insights did not disappoint.
iNEMI Presents Packaging Interconnect Material Technology Series with Dr. Kazuhiro Nogita
09/09/2024 | iNEMIiNEMI, a leading electronics manufacturing industry association, is pleased to announce a two-part webinar series focusing on packaging interconnect material technology. Dr. Kazuhiro Nogita, a leading expert in the field, will present on September 17-24, 2024.
Indium Experts to Speak on Sustainable e-Mobility and PCB Supply Solutions at Productronica India
09/09/2024 | Indium CorporationIndium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on September 12 in Delhi, India.