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DOD Awards $39.9 Million to Strengthen U.S. Supply Chains for PCBs

11/16/2023 | U.S. DoD
The Department of Defense announced an award of $39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics Corporation to enhance capabilities to produce High-Density Build-Up (HDBU) substrates, which include High-Density Interconnect Printed Circuit Board (PrCB) cores and HDBU build-up layers.

Ucamco's LeVina: Direct Imaging for Next-gen Packaging Substrates

11/14/2023 | Ucamco
Ucamco is proud to introduce LeVina to the European market. LeVina is the perfect Direct Imaging solution for next-gen packaging substrates. 

AT&S Provides Sophisticated IC Substrates for High-performance AMD Data Center Processors and Accelerators

11/08/2023 | AT&S
AT&S quickly established itself as a reliable substrate supplier for AMD and is currently preparing a significant expansion of capacity for AMD. “AMD’s quality requirements are very high, which makes us very proud to have achieved the ramp-up so fast.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/29/2023 | Andy Shaughnessy, I-Connect007
This week’s must-reads cover a little bit of everything: advanced packaging substrates, rigid-flex design, the potential loss of tribal knowledge, ultra HDI processing, and the need for fabricators to begin utilizing Smart systems. In a few weeks, we’ll be attending SMTA International in Minneapolis, and then productronica in Munich. We hope to see you on the road!

Pivoting on Substrates

09/27/2023 | I-Connect007 Editorial Team
Oved Shapira is CEO of PCB Technologies, the Israeli-based printed circuit provider. PCB Technologies has recently invested in facilities and expertise to design, fabricate, and assemble substrates, a key component for advanced packaging technologies. Oved spoke with Barry Matties and Nolan Johnson about how advanced packaging will influence the industry. He said it will shift everything, including design, fabrication, assembly techniques, and capital equipment development. Some of these shifts might be subtle, and others more seismic. Whatever the changes, Oved says it’s coming.
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