Thermaltronics to Showcase Cutting-Edge Soldering Solutions at SMTA Guadalajara Expo & Tech Forum
September 21, 2023 | Thermaltronics USA, Inc.Estimated reading time: 1 minute

Thermaltronics USA, Inc., a globally acclaimed manufacturer of Precision Soldering Robots and innovative Curie point soldering systems, is excited to announce its participation in the highly anticipated SMTA Guadalajara Expo & Tech Forum, scheduled to take place from October 25-26, 2023. The event will be held at The Guadalajara Expo & Tech Forum, and attendees are invited to visit booth #114 to witness firsthand the cutting-edge soldering solutions offered by Thermaltronics.
TROIKA LATIN AMERICA, Thermaltronics’ esteemed representative in Mexico, will be showcasing the company's groundbreaking soldering technologies at the expo. Gerardo Rodriguez, the principal of TROIKA LATIN AMERICA, expressed his enthusiasm for the event, stating, “We are thrilled to provide attendees with an opportunity to experience the advanced capabilities of Thermaltronics’ Soldering Robot and Curie point soldering systems.”
The SMTA Guadalajara Expo & Tech Forum comes at a crucial juncture, with the manufacturing industry witnessing a surge in activity coupled with a shortage of skilled labor. In this context, the advantages of automating the soldering process have never been more apparent. Gerardo is confident that Thermaltronics' Soldering Robot will not only address these challenges but also redefine the standards of efficiency and precision.
Thermaltronics’ participation in the expo underscores its unwavering commitment to innovation. The company's Precision Soldering Robots and Curie point soldering systems are designed to revolutionize the electronics manufacturing industry by enhancing productivity, precision, and reliability.
Suggested Items
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
SMTA Bridging the Skills Gap in Arizona
04/24/2025 | Marcy LaRont, I-Connect007One area where SMTA really excels is through its local chapters. On April 16, 2025, I-Connect007's Marcy LaRont attended the Workforce Breakfast during the SMTA Arizona Expo & Tech Forum in Mesa, which featured more than 50 electronics professionals from the local area, including defense OEMs, and others who were attending for the first time. Blackfox and Hyrel Technologies sponsored the event. The keynote presentation featured Sean Denny, a professor at Estrella Mountain Community College, who emphasized a clear need for skilled hand soldering technicians.
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
04/23/2025 | IPCIPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.