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Fresh PCB Concepts: The Journey of a PCB—A Tale of Sustainability and Circularity

09/18/2024 | Team NCAB -- Column: Fresh PCB Concepts
Imagine a bustling factory floor where hundreds of PCBs hum with potential, each one destined to be the brain of a new electronic device. From the sleek smartphone in your pocket to the intricate systems in electric vehicles, PCBs are the unsung heroes of our digital world. But have you ever wondered what happens to these tiny powerhouses when their work is done? The journey of a PCB doesn’t end when a device reaches the end of its life. In fact, that’s where the next chapter begins—a chapter that’s critical for our environment and our future.

Royal Mint Launches Gold Recovery Factory from E-Waste

08/08/2024 | Royal Mint
A pioneering new factory that provides a more sustainable source of gold and reduces reliance on mining has been unveiled by The Royal Mint.

Conecsus Metals Mexico to Exhibit Waste Recycling Solutions at SMTA Guadalajara Expo & Tech Forum

07/25/2024 | Conecsus
Conecsus Metals México, an innovative environmental technology and recycling company, will exhibit at the SMTA Guadalajara Expo & Tech Forum on September 11 & 12, 2024, in Booth #422.

An Electrifying Improvement in Copper Conductivity

12/28/2023 | PNNL
A common carbon compound is enabling remarkable performance enhancements when mixed in just the right proportion with copper to make electrical wires. It’s a phenomenon that defies conventional wisdom about how metals conduct electricity.

Material Insight: The Material Science of PCB Thermal Reliability

10/25/2023 | Dr. Preeya Kuray -- Column: Material Insight
Printed circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.
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