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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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CIMS to Exhibit at TPCA 2023 in Taipei
September 26, 2023 | CIMSEstimated reading time: Less than a minute
TPCA is the main annual PCB event in Taiwan. This year, it takes place in Taipei on 25-27 October.
This year we are proud to present several new and exciting products that will surely benefit our customers. Those include brand new family or high resolution AOI equipped with innovative image acquisition and lighting solutions, as well as AI-based verification software and hardware. In addition, we will be featuring our CAM and pre-CAM software and material handling automation for smart factories.
We will be exhibiting in the booth L323. Visit us and learn more about our latest products.
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