Material Insight: A Conversation with Congressman Blake Moore
It’s Only Common Sense: Going Well Beyond the Norm
The New Chapter: Teach the TerminologyiNEMI/ZESTRON Workshop on Reliability & Standards for Automotive Electronics
September 27, 2023 | iNEMIEstimated reading time: Less than a minute
Join iNEMI and ZESTRON in Shenzhen on October 13 for a full-day workshop on reliability requirements and challenges for automotive electronics and to share the latest information about standards development for this market segment.
The rapidly growing automotive electronics sector is driving development of new materials and technologies which pose new challenges and reliability concerns. This interactive forum will give participants the opportunity to discuss and share knowledge and experiences on topics such as:
- Material and technology trends for automotive electronics
- Current reliability issues affecting electronics in EVs, including material characterization, failure analysis, reliability design, etc.
- Identify knowledge gaps and collaboration opportunities to mitigate reliability risks and improve yield and quality
- Standards development/revision and deployment
The agenda includes speakers from AT&S, Continental, CRRC, Indium Corporation, iNEMI, Keysight Technologies, NIO and ZESTRON. You’ll have the opportunity to meet and network with technical leaders and experts from the automotive electronics supply chain, including representatives from such companies as BYD, CATL and Geely. Plus, the event includes a visit to the ZESTRON South China Analytical Center & Technical Center.
Share on:
Suggested Items
NextFlex Announces $6.5M Funding for Flexible Hybrid Electronics Innovations in Extreme Environments and Sustainability
11/15/2023 | BUSINESS WIRENextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Innovation Institute, announced $6.49M in funding (including $3.29M in cost-share contribution from participants) for seven new projects as part of its Project Call 8.0 to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.
Improve Board Level Reliability by Reducing Solder Joint Voiding Below 10%
11/13/2023 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leader in integrated materials and technologies for the electronics industry, launches ALPHA® OM-362, its latest next-generation low-void solder paste.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/03/2023 | Nolan Johnson, I-Connect007When I use our analytics to see what’s of most interest to our readers, what comes to the top of list are topics such as sustainability, materials, reshoring, upskilling, and high reliability. It makes sense, doesn’t it? In today’s business climate, we must be ever aware of the impact we’re having on the environment while maintaining a high-quality product that supports our national economic and security interests.
Indium to Exhibit Industry-Leading EV Products at Productronica
11/02/2023 | Indium CorporationIndium Corporation® is proud to showcase its proven advanced assembly materials for PCBA and power electronics, including those for the rapidly evolving electric vehicle manufacturing and e-Mobility market, at Productronica, November 14-17, in Munich, Germany.
Silicon Frogs and Smashing Asteroids: A Review of the IPC High Reliability Forum
11/01/2023 | Teresa Rowe, IPC Senior Director, Assembly and Standards TechnologyIn the electronics industry, we all agree about the expectation that items leaving Earth must work all the time, and we expect the same level of reliability from our communications systems and our cars. There may be differences in the hardware, but vigilance during design and build are integral to ensuring mission success. We kept this expectation in mind for nearly two years, as we planned and then executed the IPC High Reliability Forum, Oct. 17-18 in Baltimore, Maryland.