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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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iNEMI/ZESTRON Workshop on Reliability & Standards for Automotive Electronics
September 27, 2023 | iNEMIEstimated reading time: Less than a minute
Join iNEMI and ZESTRON in Shenzhen on October 13 for a full-day workshop on reliability requirements and challenges for automotive electronics and to share the latest information about standards development for this market segment.
The rapidly growing automotive electronics sector is driving development of new materials and technologies which pose new challenges and reliability concerns. This interactive forum will give participants the opportunity to discuss and share knowledge and experiences on topics such as:
- Material and technology trends for automotive electronics
- Current reliability issues affecting electronics in EVs, including material characterization, failure analysis, reliability design, etc.
- Identify knowledge gaps and collaboration opportunities to mitigate reliability risks and improve yield and quality
- Standards development/revision and deployment
The agenda includes speakers from AT&S, Continental, CRRC, Indium Corporation, iNEMI, Keysight Technologies, NIO and ZESTRON. You’ll have the opportunity to meet and network with technical leaders and experts from the automotive electronics supply chain, including representatives from such companies as BYD, CATL and Geely. Plus, the event includes a visit to the ZESTRON South China Analytical Center & Technical Center.
Suggested Items
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
05/01/2025 | Team NCAB -- Column: Fresh PCB ConceptsAs a field application engineer with many years of experience, I’ve conducted thousands of designs for manufacturing (DFM) analyses on printed circuit boards (PCBs). From basic one-layer boards to complex high density interconnect (HDI) designs, I’ve provided technical advice across a wide spectrum of technologies.
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.
Microchip Completes Radiation-Hardened Power MOSFET Family to MIL-PRF-19500/746 and Achieves JANSF 300 Krad Capability
04/22/2025 | MicrochipThe JANS qualification represents the highest level of screening and acceptance requirements, ensuring the superior performance, quality and reliability of discrete semiconductors for aerospace, defense and spaceflight applications.