-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
TTM Technologies CFO Dan Boehle Wins CFO of the Year Award from the Los Angeles Business Journal
September 28, 2023 | TTM TechnologiesEstimated reading time: 1 minute

TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and printed circuit boards (PCB), announced that its Chief Financial Officer, Dan Boehle, was honored at the 2023 Los Angeles Business Journal (LABJ) CFO of the Year Awards ceremony. The ceremony was held on Thursday, September 21, 2023 at the Biltmore Hotel.
Boehle was presented with the Turnaround Achievement Award in recognition of his role as CFO of Aerojet Rocketdyne. In that role, he led his team, and the company, through major organizational and governance changes. Boehle’s finance and business acumen, and his consistent focus on providing the best and most valuable outcome for the company’s employees, shareholders, and customers made him a critical part of the senior management team that led the company through these changes and ultimately increased the market value and future sustainability of the company. Following the closure of the sale of Aerojet Rocketdyne to L3Harris, Dan joined TTM on August 21st, 2023 becoming the CFO on September 11th, 2023.
“We are excited to have Dan as part of the leadership team at TTM,” said Tom Edman, CEO of TTM. “He successfully led and navigated Aerojet Rocketdyne through complex challenges eventually leading to a sale that increased shareholder value and this recognition is well deserved.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.