Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

onsemi East Fishkill Fab Accredited as Trusted Foundry by Department of Defense

10/29/2024 | BUSINESS WIRE
onsemi announced its wafer fab in East Fishkill (EFK), New York, has been accredited by the Defense Microelectronics Activity (DMEA) of the U.S. Department of Defense (DoD) as a Category 1A Trusted Supplier.

Renesas Collaborates with Intel on Best-in-Class Power Management Solution for New Intel Core Ultra 200V Series Processors

10/24/2024 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced a collaboration with Intel resulting in a power management solution that delivers best-in-class battery efficiency for laptops based on the new Intel® Core™ Ultra 200V series.

Northrop Grumman’s Deep Sensing and Targeting Technology Goes Airborne to Advance Vision for the US Army

10/22/2024 | Northrop Grumman
Phase two of Northrop Grumman Corporation’s Deep Sensing and Targeting (DSaT) system was successfully demonstrated at Vanguard 24, an annual capstone experiment hosted by the U.S. Army. DSaT gathers space-based data for long-range precision fires while airborne, helping bridge specific capability gaps and future warfighting requirements by expanding mission effectiveness and standoff range for Army platforms.

KDDI Selects Samsung To Deploy Open RAN Powered by Virtualized RAN in Japan

10/21/2024 | Samsung
Samsung Electronics announced that the company has been selected by KDDI as a main vendor to provide 4G and 5G O-RAN compliant virtualized Radio Access Network (vRAN) solutions for their Open RAN deployment in Japan.

Intel and AMD Form x86 Ecosystem Advisory Group to Accelerate Innovation for Developers and Customers

10/18/2024 | Intel
Intel Corporation and AMD announced the creation of an x86 ecosystem advisory group bringing together technology leaders to shape the future of the world’s most widely used computing architecture. x86 is uniquely positioned to meet customers’ emerging needs by delivering superior performance and seamless interoperability across hardware and software platforms.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in