The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
KYZEN’s Debbie Carboni to Present in Panel Session at IPC High Reliability Forum
October 2, 2023 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, announced that Debbie Carboni, Global Product Line Manager - Electronics, will present as part of the Electric Vehicle (EV) panel during the IPC High Reliability Forum. The presentation entitled, “Revving Up Reliability: Connect, Clean and Cost for Electric Vehicle Excellence,” will take place Wednesday, Oct. 18, 2023, from 8:40 to 10:00 a.m. at the Hilton Baltimore BWI Airport in Linthicum, MD.
Carboni will be one of three presenters including Brian O’Leary of Indium and Brian Chislea of Dow. During the panel session, Carboni will represent KYZEN’s involvement in a collaborative study conducted with fellow industry leaders. She will offer insights to improve uptime performance to mitigate costly warranty repairs and enhance customer satisfaction.
The EV Panel session will focus on the resolution of durability concerns regarding PCBAs in e-Mobility infrastructure encompassing electric vehicles, charging stations, and Battery Energy Storage Systems. The overall goal of the session is to provide practical strategies for enhancing reliability in e-Mobility components and optimize overall user experience. The session will also consider assembly design challenges and offer solutions for constructing more dependable systems.
The IPC High Reliability Forum provides a unique opportunity for attendees to learn about the latest advancements in electronics, participate in industry discussions, and network within the respected community of professionals focused on electronics with high reliability requirements.
Share on:
Suggested Items
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/15/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
07/08/2025 | Mike Konrad -- Column: The Knowledge BaseIn electronics manufacturing, there’s a dangerous misconception that cleaning and coating are standalone options, that they operate in different lanes, and that one can compensate for the other. Let’s clear that up now. Cleaning and conformal coating are not separate decisions. They are two chapters in the same story—the story of reliability.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.