Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

NextFlex Announces $6.5M Funding for Flexible Hybrid Electronics Innovations in Extreme Environments and Sustainability

11/15/2023 | BUSINESS WIRE
NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Innovation Institute, announced $6.49M in funding (including $3.29M in cost-share contribution from participants) for seven new projects as part of its Project Call 8.0 to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.

Improve Board Level Reliability by Reducing Solder Joint Voiding Below 10%

11/13/2023 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions, a leader in integrated materials and technologies for the electronics industry, launches ALPHA® OM-362, its latest next-generation low-void solder paste.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

11/03/2023 | Nolan Johnson, I-Connect007
When I use our analytics to see what’s of most interest to our readers, what comes to the top of list are topics such as sustainability, materials, reshoring, upskilling, and high reliability. It makes sense, doesn’t it? In today’s business climate, we must be ever aware of the impact we’re having on the environment while maintaining a high-quality product that supports our national economic and security interests.

Indium to Exhibit Industry-Leading EV Products at Productronica

11/02/2023 | Indium Corporation
Indium Corporation® is proud to showcase its proven advanced assembly materials for PCBA and power electronics, including those for the rapidly evolving electric vehicle manufacturing and e-Mobility market, at Productronica, November 14-17, in Munich, Germany.

Silicon Frogs and Smashing Asteroids: A Review of the IPC High Reliability Forum

11/01/2023 | Teresa Rowe, IPC Senior Director, Assembly and Standards Technology
In the electronics industry, we all agree about the expectation that items leaving Earth must work all the time, and we expect the same level of reliability from our communications systems and our cars. There may be differences in the hardware, but vigilance during design and build are integral to ensuring mission success. We kept this expectation in mind for nearly two years, as we planned and then executed the IPC High Reliability Forum, Oct. 17-18 in Baltimore, Maryland.
Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in