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Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/01/2025 | Nolan Johnson, I-Connect007
We start with the latest report from the Global Electronics Association: North American PCB sales are down 8.6% in June. That might sound grim, but keep reading—there’s more to the story. Bookings are holding steady, and Dr. Shawn DuBravac offers context that paints a more balanced picture. Next, we turn our gaze to India, where mobile phone exports have surged 127-fold over the past decade. That stat alone says volumes about India’s emergence as a force in electronics manufacturing, something we’ll be digging into more deeply in an upcoming SMT007 feature.

Beyond Design: AI-driven Inverse Stackup Optimization

12/26/2024 | Barry Olney -- Column: Beyond Design
Artificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.

enSights Raises $10M to Scale its AI-Powered Clean Energy Optimization Business

12/05/2024 | PRNewswire
enSights, an AI-powered, cloud-based clean energy optimization and management platform company, announced today that it completed a $10 million Series A funding round, co-led by venture capital firms JAL Ventures and XT VC, with the participation of the Menomadin Foundation.

IPC Announces Two New Courses to Enhance Electronics Manufacturing Excellence

12/03/2024 | IPC
IPC is excited to announce the launch of two new courses designed to optimize electronics manufacturing processes: "Ensuring Excellence: IPC-J-STD-001 Process Optimization" and "Ensuring Excellence: IPC-A-610 Process Optimization."

Beyond Design: Integrated Circuit to PCB Integration

09/11/2024 | Barry Olney -- Column: Beyond Design
Technologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.
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