Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Infineon Achieves World-First 300mm SiC Wafer Milestone

11/11/2026 | Infineon
Infineon Technologies AG has successfully processed 300-millimeter silicon carbide wafers into functional power devices at its fab in Villach, Austria.

I-Connect007 Welcomes Dr. Cody Schoener as Newest Mil/Aero Columnist

11/09/2026 | I-Connect007
I-Connect007 is excited to welcome Dr. Cody Schoener of Dow as a new monthly columnist for our weekly Mil/Aero Newsletter. His column, Built to Survive, will explore the materials and technologies used to protect electronics in demanding military, aerospace, and aviation environments.

Infineon to Build Europe’s First 300mm GaN Power Semiconductor Fab

10/27/2026 | Infineon
Infineon Technologies AG is establishing the world’s first high-volume manufacturing facility for next-generation gallium nitride (GaN) power semiconductors on 300-millimeter wafers in Europe.

The Need for Speed in Mil/Aero Manufacturing

10/20/2026 | Marcy LaRont, I-Connect007 Magazine
Military and aerospace manufacturers are being asked to move faster, whether developing new drone technologies, responding to supply constraints, or getting new designs from prototype to production. James Hofer of Accurate Circuit Engineering sees that pressure as changing more than just manufacturing schedules. He talks about the growing role of quick-turn PCB fabrication, new relationships between defense primes and startups, and why even long-established approaches to standards and manufacturing have to become more adaptable.

Infineon, Wolfspeed Sign 200mm SiC Wafer Supply Agreement

10/15/2026 | Infineon
Infineon Technologies AG and Wolfspeed, Inc. have signed a new multi-year supply agreement for 200-millimeter silicon carbide (SiC) wafers, transitioning Infineon's existing Wolfspeed supply relationship from 150-millimeter to 200-millimeter substrate technology.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in