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Suggested Items

The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation

04/21/2026 | Steve Williams -- Column: The Right Approach
The Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.

Northrop Grumman Delivers GPS-Jamming-Resistant Airborne Navigation System

04/20/2026 | Northrop Grumman
Northrop Grumman delivered the first production unit of the EGI-M navigation system, designed to provide military users with accurate positioning, navigation and timing (PNT) data.

Lockheed Martin Wins $105M U.S. Space Force Contract for GPS Ground Control Upgrade

04/20/2026 | Lockheed Martin
Lockheed Martin has been awarded a contract worth up to $105 million by the U.S. Space Force to continue modernizing and sustaining the Global Positioning System (GPS) ground control network.

Boeing, Millennium Scale Space Production to Meet Growing Demand

04/20/2026 | Boeing
Boeing and its subsidiary Millennium Space Systems are expanding space production capacity and broadening their satellite portfolio to help government and commercial customers field capability faster and with greater flexibility.

Below the Surface: Looking Ahead to Where Integration Actually Happens

04/20/2026 | Chandra Gupta -- Column: Below the Surface
Progress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.
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