Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

TLT Electronics Officially Opens Facility in Vietnam

05/06/2026 | TLT Electronics
Lithuanian EMS provider TLT Electronics has recently announced the opening of a new facility in Vietnam. For their clients, this is a chance to expand manufacturing into a second region without the headache of onboarding a new supplier. Same team, same processes, same quality standards — still TLT Manufacturing, just on another continent.

Foxconn Partners with SAP to Boost AI Manufacturing

03/18/2026 | Foxconn
Hon Hai Technology Group plans to accelerate the adoption of next generation enterprise AI across the Asia-Pacific (APAC) region in strategic partnership with SAP SE, a global leader in enterprise applications and business AI.

East Asia at APEX EXPO 2026: Focusing on Cross-regional Exchange and Industry Connectivity

03/03/2026 | Sydney Xiao, Global Electronics Association East Asia
At APEX EXPO 2026, the Global Electronics Association East Asia team will promote engagement with global experts, industry partners, and member companies by participating in technical committee meetings and industry forums, and by organizing networking dinners and exhibitor visits. More than 40 companies from East Asia are expected to exhibit at this year’s show, representing Mainland China, Taiwan Region, Japan, and Korea.

A New Era for Global Trade and Electronics

10/28/2025 | Chris Mitchell, VP of Global Government Relations, Global Electronics Association
The global trade system is undergoing an enormous, systemic paradigm shift. For decades, the World Trade Organization (WTO), with the support of the United States, its traditional European allies, and many other nations, stood at the center of efforts to create fairer, more predictable, and rules-based commerce. Today, however, that model is giving way to a more fragmented reality—so far U.S.-driven—in which individual nations and blocs are striking deals and imposing a variety of rules of their own liking.

Advancing Electrolytic Copper Plating for AI-driven Package Substrates

08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ Atotech
The rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in