Nisshinbo Micro Devices Inc. Accelerates IC/Module Designs using Cadence Custom IC and System Analysis Technology
October 6, 2023 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
Cadence Design Systems, Inc. announced that Nisshinbo Micro Devices Inc. has deployed multiple Cadence® solutions, including the AI-based Virtuoso® Studio custom IC design platform and Clarity™ 3D Solver, to improve design efficiency and reliably deliver products to market. Using the Clarity 3D Solver, Nisshinbo Micro Devices Inc. has achieved up to a 12% electromagnetic (EM) simulation runtime improvement when compared with their prior solution.
By deploying the AI-based Virtuoso Studio platform, Nisshinbo Micro Devices Inc. has access to a full suite of IC design solutions and tight integration with Cadence’s multiphysics system analysis offerings. Nisshinbo Micro Devices Inc. uses the Virtuoso Schematic Editor for design capturing and the Virtuoso ADE Suite and the integrated Spectre® X Simulator to enable its circuit designers to manage corner simulations, statistical analyses, design centering, and circuit optimization. The Virtuoso Layout Suite contains multiple functions, such as concurrent layout editing and design review, that foster user collaboration. Concurrent layout editing allows the partitioning of a layout into many portions, assigning them to different users who can then work independently on their part of the project. Nisshinbo Micro Devices Inc. designers used this feature to gain a 30% reduction in turnaround time for routing of complex analog blocks.
Nisshinbo Micro Devices Inc. has also adopted the Clarity 3D Solver for EM simulation and analysis of its module designs after confirming a 12% solver runtime advantage. With its novel, innovative and proprietary massively parallel matrix solver, the Clarity 3D Solver delivers near-linear scalability without any loss in accuracy. Capacity, accuracy, and simulation speed are all achieved concurrently with no need to trade off one for another to realize an optimum design solution in a reasonable time. Through its seamless integration and streamlined in-design analysis workflow with Cadence IC packaging and PCB design platforms, engineering productivity and turnaround time (TAT) are significantly improved.
“For us to continue shipping reliable analog IC and module products to the market in a timely manner, we need to keep improving our design efficiency,” said Yasutoshi Hirano, Manager, Design Technology Department, Technology Development Division, Electronic Devices Business Headquarters, Nisshinbo Micro Devices Inc. “Using Cadence Virtuoso Studio, the latest custom IC design solution, and the Cadence Clarity 3D Solver together, we have demonstrated a more comprehensive chip-to-package design environment for faster and more reliable product development.”
Cadence custom IC and system analysis solutions support the Cadence Intelligent System Design™ strategy, accelerating system innovation.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Setting Design Constraints Effectively
07/31/2025 | Stephen V. Chavez, Siemens EDAPCB design requires controlling energy within the medium of a PCB. The manner in which we control the chaos of energy is by implementing and utilizing physical and electrical rules, known as constraints, along with a specific structure and material(s) that make up what is known as the foundation of the design. These rules govern everything within the PCB structure and generally fall into two camps: performance and manufacturability. Setting this foundation correctly is extremely important and the key to success.
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
Ansys 2025 R2 Enables Next-Level Productivity by Leveraging AI, Smart Automation, and Broader On-Demand Capabilities
07/30/2025 | PRNewswireAnsys, now part of Synopsys, announced 2025 R2, featuring new AI-powered capabilities across the portfolio that accelerate simulation and expand accessibility.
Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
07/31/2025 | Matt Stevenson -- Column: Connect the DotsAs HDI technology becomes mainstream in high-speed and miniaturized electronics, understanding the PCB manufacturing process can help PCB design engineers create successful, cost-effective designs using advanced technologies. Designs that incorporate blind and buried vias, boards with space constraints, sensitive signal integrity requirements, or internal heat dissipation concerns are often candidates for HDI technology and usually require sequential lamination to satisfy the requirements.
Target Condition: The 5 Ws of PCB Design Constraints
07/29/2025 | Kelly Dack -- Column: Target ConditionHave you ever sat down to define PCB design constraints and found yourself staring at a settings window with more checkboxes than a tax form? You’re not alone. For many designers—especially those newer to the layout world—the task of setting up design constraints can feel like trying to write a novel in a language you just started learning.