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Smart and Compact Sensors with Edge-AI

04/16/2025 | Fraunhofer
A newly launched interdisciplinary research project involving universities of Brandenburg and research institutions is developing new technological approaches for better and more effective integration of artificial intelligence at the edges of IT networks, so-called “edges”.

New TSN-MACsec IP Core for Secure Data Transmission in 5G/6G Communication Networks

04/15/2025 | Fraunhofer
Reliability and security in broadband communication networks (5G/6G) are crucial for meeting the challenges of the digital future. Together with aconnic AG, Fraunhofer IPMS has developed an innovative IP core as part of the “RealSec5G” project, which combines the advantages of a MACsec IP core with those of a Time-Sensitive Networking (TSN) IP core.

TSMC, ASE Join Forces with 100+ Companies to Drive Silicon Photonics Technology Integration

04/11/2025 | SEMI
The SEMI Silicon Photonics Industry Alliance (SiPhIA) held the Bridging Light & Silicon: SEMI SiPhIA SIGs Kick-off & Seminar today, announcing the official launch of three Special Interest Groups (SIGs) aimed at integrating expertise from various sectors to formulate industry standards and accelerate technological innovation and commercialization.

Samsung Electronics MENA Selects ChannelEngine to Power Marketplace Growth and Automation Across the Region

04/08/2025 | PRNewswire
ChannelEngine, a global leader in marketplace integration and operation software, announced its collaboration with Samsung Electronics MENA to streamline and expand Samsung's presence across leading online marketplaces in the MENA region.

Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions

03/24/2025 | Zuken
Zuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member. The IBM Research AI Hardware Center, a global research hub headquartered at the Albany NanoTech Complex in Albany, NY, aims to develop next-generation chips and systems, including advanced semiconductor packaging, that support the processing power and unprecedented speed that AI requires.
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