Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

4Q24 Global Top 10 Foundries Set New Revenue Record, TSMC Leads in Advanced Process Nodes

03/10/2025 | TrendForce
TrendForce’s latest research reveals that the global foundry industry exhibited a polarized trend in 4Q24. Advanced process nodes benefited from strong demand in AI servers, flagship smartphone application processors (APs), and new PC platforms, driving high-value wafer shipments.

AT&S Opens New Sales Office in Seoul

03/07/2025 | AT&S
AT&S, a leading manufacturer of high-end printed circuit boards and IC substrates, is demonstrating its long-term commitment to Korea by opening a new sales office in Seoul. The office will serve as a central hub for regional customers and enable closer collaboration with partners.

Jabil Announces Expansion into Gujarat

03/06/2025 | Jabil
Jabil Inc., a global leader in engineering, supply chain, and manufacturing solutions, announced that it will open a new factory in Gujarat, its second in the country.

Jaltek Joins Midlands Aerospace Alliance

03/06/2025 | Jaltek
Jaltek are delighted to officially announce that they have joined the Midlands Aerospace Alliance (MAA). The MAA which was formed in 2003 to support and represent the aerospace industry across the Midlands region, now represents one of the largest aerospace clusters in the world and is one of the strongest advocates for both the aerospace industry and the Midlands region.

IMAPS’ Annual Conference Opener in Phoenix ‘Blew My Mind’

03/05/2025 | Marcy LaRont, I-Connect007
It was a cool and sunny morning as I headed out to the IMAPS Device Packaging Conference 2025 in Arizona early Tuesday, which featured two compelling keynote speakers, and a day chocked full of technical sessions. IMAPS 2025 also hosted a sold-out exhibit hall with 65 exhibitors from IBM and Heraeus to Cadence and KYZEN, to name just a few. The technology and packaging discussions at this conference blew my mind last year, and it is clear this year would be no different.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in