Hyundai Motor, Kia, Infineon Sign Multi-year Supply Agreement for Power Semiconductors
October 23, 2023 | InfineonEstimated reading time: 1 minute
Infineon Technologies AG and Hyundai Motor Company and Kia Corporation have signed a multi-year supply agreement for silicon carbide (SiC) and silicon (Si) power semiconductors. Infineon will build and reserve manufacturing capacity to supply SiC as well as Si power modules and chips to Hyundai/Kia until 2030. Hyundai/Kia will support the capacity build-up and capacity reservation with financial contributions.
“Infineon stands as a valued strategic partner, boasting steadfast production capabilities and distinct technological prowess within the power semiconductor market,” said Heung Soo Kim, Executive Vice President and Head of Global Strategy Office (GSO) at Hyundai Motor Group. “This partnership not only empowers Hyundai Motor and Kia to stabilize its semiconductor supply but also positions us to solidify our leadership in the global EV market, underpinned by our competitive product lineups.”
“The future car will be clean, safe and smart and semiconductors are at the heart of this transformation. As a trusted partner, we are proud to advance our long-term partnership with Hyundai/Kia,” said Peter Schiefer, President of Infineon's Automotive Division. “We contribute premium products of high quality, our system knowledge and application understanding combined with continued investments in manufacturing capacity to address the increasing demand for automotive power electronics.”
Infineon's power semiconductors are key enablers for the transition to electromobility. This transition will lead to strong market growth for power semiconductors, especially those based on wide bandgap materials like SiC. With the significant expansion of its Kulim fab, Infineon will build the world's largest 200-millimeter SiC power fab and further strengthen its market-leading role as a high-quality, high-volume supplier to the automotive industry. In line with Infineon's multi-site strategy, the Kulim facility will complement Infineon's current manufacturing capacity in Villach, Austria, and further capacity expansions in Dresden, Germany.
Suggested Items
TRI: Inspection Innovations at Focus on PCB Expo
04/09/2025 | TRII-Tronik, TRI's distributor, will showcase cutting-edge AI-powered inspection solutions at Focus on PCB 2025, taking place at Fiera di Vicenza, Italy, from May 21–22, 2025.
DARPA Selects Cerebras to Deliver Next Generation, Real-Time Compute Platform for Advanced Military and Commercial Applications
04/08/2025 | RanovusCerebras Systems, the pioneer in accelerating generative AI, has been awarded a new contract from the Defense Advanced Research Projects Agency (DARPA), for the development of a state-of-the-art high-performance computing system. The Cerebras system will combine the power of Cerebras’ wafer scale technology and Ranovus’ wafer scale co-packaged optics to deliver several orders of magnitude better compute performance at a fraction of the power draw.
BAE Systems to Power New Hybrid-electric Bus Fleet in San Francisco
04/08/2025 | PRNewswireBAE Systems (LON:BA), a leader in heavy-duty electric propulsion, will provide 42 electric drive systems for the San Francisco Municipal Transportation Agency's (SFMTA) new fleet of hybrid-electric buses.
epoxySet Introduces EC-1019 – Thermally Conductive, Crack Resistant Epoxy Potting
04/07/2025 | epoxySetepoxySet introduces the EC-1019, specialized epoxy potting compound. This system utilizes unique chemistry and fillers to offer a thermally conductive compound that has very small particulate size of about 15um.
IPC APEX EXPO Special Sessions: A Focus on Advanced Electronic Packaging
04/09/2025 | Tracy Riggan, IPCThe IPC Technology Solutions team hosted two special sessions on Thursday, March 20 at IPC APEX EXPO 2025 focused on advanced electronic packaging. The first session focused on AI/data center applications and the second on power electronics applications. The day kicked off with opening remarks on strategic direction of IPC in the area of advanced electronic packaging from Matt Kelly, IPC CTO, and an overview of the current landscape of component and system level packaging by Devan Iyer, PhD, IPC chief strategist, advanced packaging.