-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Alex Stepinski on High-reliability Fabrication
October 23, 2023 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

Alex Stepinski, principal and president of Stepinski Inc., and principal of Smart Process Design, has designed leading-edge PCB facilities and introduced a variety of novel systems and technologies into PCB manufacturing. We asked Alex to share his thoughts on high-reliability fabrication techniques, where manufacturers go wrong, and what fabricators need to do to step up their reliability game.
Barry Matties: Where does high reliability intersect with bare board fabrication and what should readers be thinking about?
Alex Stepinski: It’s about service life. That's what the clients want. They want high reliability so it doesn't fail in the field, and when it does, it's very far away in time. You must do accelerated testing to confirm that your product will be reliable for “X amount” of time, and that it also de-risked from white rhino/black swan events and T0/latent fails.
I would break down high reliability management into two influential categories: process design and product design. During the product design, what do they control? Fabricators control KPIs to get high reliability. They should have a model, or a set of rules based upon prior history, as to what works and what doesn't work. They should also have these rules correlated to qualification methods, because one OEM might use IST, another uses a different type with different conditions, and so on.
Reliability is a subset of the test conditions, and the higher the reliability, the higher the potential product value/willingness to pay, so fabs must make sure that they correlate their testing results to their product design attributes. But that precise regression is missing in a lot of cases, and there's a lot of diversity of test/qual methods. The big question is: What are the defects and/or parametric conditions that lead to reliability failure and can they be normalized? Today, many people are talking about HDI failures. Stacking microvias has been a common topic lately.
To read this entire conversation, which appeared in the October 2023 issue of PCB007 Magazine, click here.
Suggested Items
Nortech Expands Fiber Optic Capabilities to Include MT Connectors, Strengthening Aerospace and Defense Solutions
04/16/2025 | BUSINESS WIRENortech Systems, a trusted leader in innovative connectivity solutions, announced an exciting expansion in its fiber optic capabilities with the integration of MT connectors. MT connectors, known for their ability to support multiple fiber terminations in a compact form factor, are an ideal choice for applications requiring robust data transmission and reliability.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.
Apogee Semiconductor Teams with Arrow Electronics to Expand Distribution of Space-Grade Technologies
04/14/2025 | Apogee SemiconductorApogee Semiconductor, a leading provider of advanced technologies for space and extreme environments, announced its collaboration with Arrow Electronics, a global distributor of electronic components and services.
HT Pho-Tronics Appoints Ankit B. Goti as New General Manager to Drive Strategic Growth
04/14/2025 | HT Pho-TronicsHT Pho-Tronics, a leading provider of high-reliability printed circuit boards (PCBs), proudly announces the appointment of Ankit B. Goti as the company’s new General Manager, effective immediately.
Best Papers from SMTA International Announced
04/10/2025 | SMTAThe SMTA is pleased to announce the Best Papers from SMTA International 2024. The winners were selected by members of the conference technical committee. Awards are given for "Best of Proceedings" as well as "Best Practical and Applications-Based Knowledge" categories. A plaque is given to primary authors of all winning papers for these exceptional achievements.