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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Power Delivery, AI Infrastructure, and Materials Innovation: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

07/14/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines three areas where packaging technology is increasingly defining system performance: power delivery for AI accelerators, the rapid expansion of AI data centers, and the growing importance of substrate materials in high-reliability electronics. Together, these features explore how packaging decisions influence performance, reliability, and long-term scalability across the electronics ecosystem.

LITEON June Revenue Up 37% YoY on AI Server Demand

07/10/2026 | LITEON Technology
LITEON Technology reported its June consolidated revenue of NT$18.7 billion, up 8% M-o-M and 37% Y-o-Y. Revenue growth was mainly driven by high-end server power systems for cloud and AI applications and high‑efficiency backup battery units (BBU).

Analog Devices Completes Acquisition of Empower Semiconductor

07/08/2026 | PRNewswire
Analog Devices, Inc. announced the completion of its acquisition of Empower Semiconductor. The combination further strengthens ADI's position as a leading strategic, system-level grid-to-core power partner across the entire AI ecosystem, expanding ADI's total addressable market and capabilities in AI compute power delivery.

Curtiss-Wright Announces $80M Investment to Expand Pennsylvania Operations

07/08/2026 | BUSINESS WIRE
Curtiss-Wright Corporation announced an $80 million, multi-year investment to expand operations at its Cheswick, Pennsylvania facility, part of the Company’s Naval & Power segment, through a combination of internal capital investments, state support and maritime industrial base funding via the U.S. Department of War budget.

Alpha, Omega Semiconductor Unveils AmpStack Packaging

07/08/2026 |
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today introduced its AOPL66801 80V MOSFET in a half-bridge configuration available in a state-of-the-art DFN6x5 AmpStack™ MOSFET package.
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