Infineon to Pilot New AI Developer Model by Archetype AI to Enhance AI Sensor Solution Innovation
October 24, 2023 | InfineonEstimated reading time: 1 minute
Infineon Technologies AG, a global semiconductor manufacturer and leader in power systems and IoT, and Archetype AI, Inc., a pioneer in AI for the physical world, announced that they have signed a strategic partnership to accelerate the future development of sensor-based chips with AI functionalities that will make life easier, safer and greener.
Archetype AI, headquartered in Silicon Valley, is a frontier AI company developing a foundation model for Physical AI, a new form of artificial intelligence that is capable of perceiving, understanding, and reasoning about the world around us. Coined a “Large Behavior Model” (LBM) by Archetype AI, Infineon will pilot this new model that can uncover the hidden patterns of behavior in unstructured sensor data and blends real-time sensor data with natural language to create a living view of the world to analyze complex sensor-based data.
Under the multi-year partnership, Infineon will be the first company to utilize the LBM AI developer platform to generate AI agents that automatically create code for customer-specific sensor use cases to run as edge models on customer devices. Sensors built by Infineon with help of the LBM platform make devices like TVs, smart speakers, and smart home appliances aware of people and the world around them. Devices can automatically wake and surface information at the right time without interrupting, users can control devices with gestures, and devices can turn-on and off based on when people are around which reduces the use of energy and contributes to decarbonization.
“We are excited to launch our strategic partnership with Archetype AI to shape innovation in Physical AI,” said Andreas Kopetz, Vice President and General Manager of Ambient Sensing at Infineon. “Infineon's innovative portfolio of IoT and sensor solutions is actively advancing decarbonatization and digitization. Archetype AI’s foundation model development platform enables us to take this to the next level with its ability to deliver even more advanced solutions, even more quickly.”
“Infineon is a great partner with a deep commitment to innovation and technical excellence,” said Ivan Poupyrev, Chief Executive Officer at Archetype AI. “We look forward to piloting our LBM AI developer platform with their world class team and providing them with the best AI technology to serve the mission critical needs of their customers in automotive, consumer electronics, healthcare, and more.”
Suggested Items
Kitron Signs €7 Million Annual Manufacturing Agreement for Advanced Sensor Technology
05/09/2025 | KitronKitron has entered into a multi-year agreement with a U.S.-based customer to manufacture advanced sensor-based products intended for the European market.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
UHDI Fundamentals: UHDI Drives Unique IoT Innovation in Farming
04/22/2025 | Anaya Vardya, American Standard CircuitsThe combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications. The typical discussions around UHDI focus on our standard electronics industry market segments like milaero, medical, consumer electronics, etc. IoT is all about machines talking to other machines, machine learning, and artificial intelligence, but again, typically applied in our PCB and assembly operations.
Smart and Compact Sensors with Edge-AI
04/16/2025 | FraunhoferA newly launched interdisciplinary research project involving universities of Brandenburg and research institutions is developing new technological approaches for better and more effective integration of artificial intelligence at the edges of IT networks, so-called “edges”.
IDTechEx Explores Emerging Applications for PICs
04/11/2025 | IDTechExPhotonic integrated circuits are the optical equivalent of microchips, using semiconductor industry processes to shrink many photonic components down onto a piece of material often smaller than a human fingernail.