-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Collaborating to Develop AI-powered Smart Assembly Processes
October 25, 2023 | Brent Fischthal, Koh Young AmericaEstimated reading time: 1 minute

In electronics manufacturing, automated production has undeniably revolutionized the industry, enabling the creation of high-quality products at an unprecedented scale. However, it comes with its own set of challenges, particularly the potential for specific failures that need human intervention. The rapid advancements in technology, such as the Industrial Internet of Things (IIoT), big data analysis, cloud computing, and artificial intelligence (AI), have ushered in the era of Industry 4.0 and promise more intelligent manufacturing processes.
Smart manufacturing, a pivotal part of this transformation, relies on real-time decision-making based on operational and inspectional data, seamlessly integrating the entire manufacturing process into a unified framework. This digital transformation of cyber-physical systems enables proactive responses to uncertain situations while ensuring heightened efficiency.
In the context of printed circuit board assembly (PCBA) with surface mount technology (SMT) lines, IIoT technology accelerates data collection on equipment status and production quality. Data-driven solutions powered by AI and machine learning algorithms can diagnose abnormal defects, as well as adjust machine parameters on the fly in response to unexpected changes during production. Collaborating with various SMT industry partners, researchers at the State University of New York at Binghamton (Binghamton University) have developed a groundbreaking framework based on AI-based closed-loop feedback control and parameter optimization. This innovation promises to implement a smart manufacturing solution in the PCB assembly, with a focus on improving yield and throughput. This AI-based framework holds the potential to pave the way for data-driven process control in SMA.
Binghamton University Collaboration
Since 2016, Koh Young Technology and the Smart Electronics Manufacturing Laboratory (SEMLab) at Binghamton University’s Integrated Electronics Engineering Center (IEEC) have been collaborating on several key research initiatives to improve the assembly process in electronics manufacturing using AI integration. The aim of the SEMLab is to develop smart electronics manufacturing solutions using data science and AI principles to manufacture sophisticated printed circuit board assemblies with a focus on advanced robotics to revolutionize the electronics manufacturing process with improved yield and productivity. With automatic optimization, real-time intelligence techniques, and the implementation of advanced analytical approaches to the data collected from the equipment, the smart systems can deliver fewer defects, higher productivity, and increased reliability with cost-efficient results.
Continue reading the rest of this article in the October 2023 issue of SMT007 Magazine.
Suggested Items
Tata Electronics, Bosch Sign MoU for Strategic Collaboration in Electronics and Semiconductor Manufacturing
07/18/2025 | Tata ElectronicsTata Electronics, a leading player in the Indian electronics and semiconductor manufacturing sector, and Robert Bosch GmbH, a leading global supplier of technology and services, announced that they have signed a Memorandum of Understanding (MoU) to collaborate on several key areas within the electronics and semiconductor industries.
HANZA Accelerates the LYNX Program Through Acquisition of Defense Manufacturer
07/18/2025 | HANZAHANZA AB has signed an agreement to acquire the contract manufacturing division of Milectria, a group of companies focused on the defense sector.
NEOTech’s Agave 1 Facility Earns AS9100 Certification for Commercial Aerospace Manufacturing Excellence
07/17/2025 | NEOTechNEOTech, a premier provider of electronic manufacturing services (EMS), integrated design engineering, and advanced supply chain solutions for the aerospace and defense, medical device, and high-tech industrial markets, proudly announces that its Agave 1 manufacturing facility in Juarez, Mexico has officially received AS9100 certification.
Libra Industries Launches In-House High Precision Underfill Capabilities
07/17/2025 | Libra IndustriesLibra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is excited to announce the addition of high-precision underfill to its in‑house manufacturing capabilities.
Fraunhofer IPMS, DIVE Optimize Semiconductor Processes with Cutting-Edge Measurement System
07/17/2025 | Fraunhofer IPMSThe Fraunhofer Institute for Photonic Microsystems IPMS, in collaboration with DIVE imaging systems GmbH, has achieved a major milestone in resource-efficient semiconductor manufacturing.