-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCertifications
Certifications have historically been seen as a cost of doing business, but how do we turn them into a positive ROI and a value to both customer and vendor?
The Butterfly Effect
The basis of chaos theory is a key concept known as the “butterfly effect.” It’s the idea that a small event in one place creates a cascading set of events elsewhere. So, how is the EMS landscape changing? We’re tracking the concerns and dynamics of this landscape, and there’s a lot to learn.
Coming to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Collaborating to Develop AI-powered Smart Assembly Processes
October 25, 2023 | Brent Fischthal, Koh Young AmericaEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/6716/3155/1676/Fischthal_Brent_275.jpg)
In electronics manufacturing, automated production has undeniably revolutionized the industry, enabling the creation of high-quality products at an unprecedented scale. However, it comes with its own set of challenges, particularly the potential for specific failures that need human intervention. The rapid advancements in technology, such as the Industrial Internet of Things (IIoT), big data analysis, cloud computing, and artificial intelligence (AI), have ushered in the era of Industry 4.0 and promise more intelligent manufacturing processes.
Smart manufacturing, a pivotal part of this transformation, relies on real-time decision-making based on operational and inspectional data, seamlessly integrating the entire manufacturing process into a unified framework. This digital transformation of cyber-physical systems enables proactive responses to uncertain situations while ensuring heightened efficiency.
In the context of printed circuit board assembly (PCBA) with surface mount technology (SMT) lines, IIoT technology accelerates data collection on equipment status and production quality. Data-driven solutions powered by AI and machine learning algorithms can diagnose abnormal defects, as well as adjust machine parameters on the fly in response to unexpected changes during production. Collaborating with various SMT industry partners, researchers at the State University of New York at Binghamton (Binghamton University) have developed a groundbreaking framework based on AI-based closed-loop feedback control and parameter optimization. This innovation promises to implement a smart manufacturing solution in the PCB assembly, with a focus on improving yield and throughput. This AI-based framework holds the potential to pave the way for data-driven process control in SMA.
Binghamton University Collaboration
Since 2016, Koh Young Technology and the Smart Electronics Manufacturing Laboratory (SEMLab) at Binghamton University’s Integrated Electronics Engineering Center (IEEC) have been collaborating on several key research initiatives to improve the assembly process in electronics manufacturing using AI integration. The aim of the SEMLab is to develop smart electronics manufacturing solutions using data science and AI principles to manufacture sophisticated printed circuit board assemblies with a focus on advanced robotics to revolutionize the electronics manufacturing process with improved yield and productivity. With automatic optimization, real-time intelligence techniques, and the implementation of advanced analytical approaches to the data collected from the equipment, the smart systems can deliver fewer defects, higher productivity, and increased reliability with cost-efficient results.
Continue reading the rest of this article in the October 2023 issue of SMT007 Magazine.
Suggested Items
Intel Names Naga Chandrasekaran to Lead Foundry Manufacturing and Supply Chain
07/26/2024 | IntelIntel Corporation today announced the appointment of Dr. Naga Chandrasekaran as chief global operations officer, executive vice president and general manager of Intel Foundry Manufacturing and Supply Chain organization.
TriMech is North America's Newest and Largest Provider of SolidCAM Software for CNC Manufacturing Technologies
07/26/2024 | PRNewswireTriMech has a new partnership with SolidCAM, known worldwide for its CAM (Computer-Aided Manufacturing) solution for efficient, user-friendly programming for all CNC manufacturing technologies, as well as its single-window integration and associativity with SOLIDWORKS.
Benchmark Celebrates Expansion of World-Class Facility in Brasov, Romania
07/26/2024 | PRNewswireBenchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, celebrated the opening of its significantly expanded presence in Brasov, Romania, continuing the company's investment in the region.
We Energies, Foxconn Complete Clean Energy Project in Wisconsin
07/25/2024 | FoxconnWe Energies, a Wisconsin-based utility company of WEC Energy Group, and Hon Hai Technology Group (Foxconn) are pleased to announce the completion of a solar panel installation project at Foxconn’s Science and Technology Park in Mount Pleasant, Wisconsin.
Collins Aerospace Relocating Singapore Plant to New $250M Manufacturing Facility in Seletar Aerospace Park, Singapore
07/25/2024 | Collins AerospaceCollins Aerospace, an RTX business, announced the relocation of its Singapore manufacturing facility to a new, state-of-the-art site in Seletar Aerospace Park, Singapore.