Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

3 Key Takeaways: Factory Analytics Turns Data Into Action

08/17/2026 | I-Connect007
Every electronics manufacturer generates data. The challenge is knowing what to do with it. In The Printed Circuit Assembler's Guide to... Factory Analytics, Julie Cliche-Dubois of Cogiscan explains how manufacturers can transform disconnected machine data into meaningful insights that improve productivity, quality, and profitability. Rather than focusing on analytics as an IT initiative, the book demonstrates how factory-wide visibility empowers everyone, from line operators to quality managers, to make smarter decisions.

4D_Additive Software Introduces New Industrial 3D Printing Workflow

08/16/2026 | CoreTechnologie
CoreTechnologie optimizes its 4D_Additive 3D printing software with a new Build History, automated data preparation, and enhanced functions for SLM supports and lattice structures.

Viscom to Showcase the Next Generation of AI-Powered Inspection at SMTA International 2026

08/14/2026 | Viscom Inc.
At SMTA International 2026, Viscom Inc. will present how artificial intelligence is changing the way electronics manufacturers approach automated quality inspection – from intelligent programming to increasingly autonomous inspection processes. 

Marvell Advances AI Memory Infrastructure Portfolio to Accelerate Agentic AI Inference

08/14/2026 | Marvell Technology, Inc.
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced new innovations across its AI memory infrastructure portfolio, advancing its position spanning server-level AI storage, rack-scale CXL memory expansion and pooling, and pod-level optical shared memory.

High-Frequency High-Speed CCL Market to Reach $3.1B by 2035

08/13/2026 | Globe Newswire
The global high frequency high speed copper clad laminate market was valued at $4.5 billion in 2025 and is estimated to grow at a CAGR of 10.3% to reach $11.8 billion by 2035.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in