Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Nano Dimension Announces Breakthrough in Materials Critical for Additively Manufactured Electronics
November 14, 2023 | Globe NewswireEstimated reading time: 1 minute
Nano Dimension Ltd., a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printing solutions, announced a breakthrough in the development of a material that is a critical enabler for the advancement of additively manufactured electronics (AME).
Materials, which are commonly known as consumables, are an important factor in the success of additive manufacturing at industrial scale. The functionality of the materials and their acceptance according to industry standards are both critical. Nano Dimension’s launch of INSU200, a dielectric ink boasting industry-leading thermo-mechanical properties, addresses both with increased functionality and greater alignment with industry standards, even going so far as to set new standards. In terms of functionality, the new material can withstand the rigorous demands of Restriction of Hazardous Substances (“ROHS”) compliant reflow soldering processes. With regards to industry standards, the new material aligns with a number of reliability standards set by IPC, the leading global association for the electronics industry, and the FED (Fachverband Elektronik-Design e.V.) in Europe.
Nano Dimension’s materials breakthrough is the result of a concerted effort by the Company, which has made materials science and development a core focus of its resource allocation strategy. This is evident in the approximate forty scientists and engineers working at the Company working across materials dedicated research facilities and labs in Germany and Israel.
Customers and industry stakeholders will have the opportunity to see this material first-hand at the Productronica Conference in Munich, Germany on November 14-17. INSU200 will be available for customers in Q1 of 2024.
Yoav Stern, Chief Executive Officer and a member of the Board of Directors of Nano Dimension, added: “We are proud to share this breakthrough in materials with our customers and the industry. When we set out a strategic plan in 2021, materials development was a core focus for our R&D team. The reality of additive manufacturing is that no matter how good the printer may be, materials must also be leading. This development achieves just that with improved functionality and critical industry standard adherence without which wider adoption would be greatly limited.”
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
IPC Standards: The Heart of the Electronics Industry
02/16/2026 | Nolan Johnson, SMT007 MagazineFrom its very inception, standards development has been at the core of the Global Electronics Association’s work, and APEX EXPO continues to serve as a major venue for standards development and approval. For example, standards committees from around the globe are expected to conduct more than 100 task group meetings during the event. We visited with the Association’s standards development team to learn more about their process, its impact on the industry, and how you can get your voice heard.
EIPC Winter Conference Review: From Innovation to Qualification
02/13/2026 | Pete Starkey, I-Connect007Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”
I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec
02/12/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test. Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.
EMS Leadership Summit: A Smarter Way to Gather EMS Leaders
02/11/2026 | Nolan Johnson, SMT007 MagazineMark Wolfe is a career EMS and electronics expert, whose leadership has helped expand and improve the EMS Leadership Summit at APEX EXPO. Last year’s event received a huge approval rating from attendees: a whopping 96% said they’d be back. Not content to rest on those laurels, Mark and his team have put together a program that preserves the Summit’s strengths while finding ways to improve. In this interview, Mark makes a strong argument why EMS leadership at all levels should take a day to examine the wider picture of our industry.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.