Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Nano Dimension Announces Breakthrough in Materials Critical for Additively Manufactured Electronics
November 14, 2023 | Globe NewswireEstimated reading time: 1 minute
Nano Dimension Ltd., a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printing solutions, announced a breakthrough in the development of a material that is a critical enabler for the advancement of additively manufactured electronics (AME).
Materials, which are commonly known as consumables, are an important factor in the success of additive manufacturing at industrial scale. The functionality of the materials and their acceptance according to industry standards are both critical. Nano Dimension’s launch of INSU200, a dielectric ink boasting industry-leading thermo-mechanical properties, addresses both with increased functionality and greater alignment with industry standards, even going so far as to set new standards. In terms of functionality, the new material can withstand the rigorous demands of Restriction of Hazardous Substances (“ROHS”) compliant reflow soldering processes. With regards to industry standards, the new material aligns with a number of reliability standards set by IPC, the leading global association for the electronics industry, and the FED (Fachverband Elektronik-Design e.V.) in Europe.
Nano Dimension’s materials breakthrough is the result of a concerted effort by the Company, which has made materials science and development a core focus of its resource allocation strategy. This is evident in the approximate forty scientists and engineers working at the Company working across materials dedicated research facilities and labs in Germany and Israel.
Customers and industry stakeholders will have the opportunity to see this material first-hand at the Productronica Conference in Munich, Germany on November 14-17. INSU200 will be available for customers in Q1 of 2024.
Yoav Stern, Chief Executive Officer and a member of the Board of Directors of Nano Dimension, added: “We are proud to share this breakthrough in materials with our customers and the industry. When we set out a strategic plan in 2021, materials development was a core focus for our R&D team. The reality of additive manufacturing is that no matter how good the printer may be, materials must also be leading. This development achieves just that with improved functionality and critical industry standard adherence without which wider adoption would be greatly limited.”
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Dan Feinberg on Walt Custer: Remembering an Extraordinary Business Associate and Friend
09/09/2025 | Dan Feinberg, Technology Editor, I-Connect007The passing of Walt Custer marks the end of an era for all those who knew him and were helped and impressed by his presence, both personally and professionally. Walt's life was characterized by his unwavering commitment to the industry, his profound wisdom and willingness to share it, and his infectious enthusiasm for everything he did.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Nolan’s Notes: Everyone Has Their Eye on India
09/03/2025 | Nolan Johnson -- Column: Nolan's NotesIn this issue of SMT007 Magazine, we turn our attention to the Indian EMS market. We start with an interview with David Bergman, whose foresight in the early 2000s opened doors for the Global Electronics Association to begin helping Indian EMS companies with standards and certifications that would give EMS companies a footing to enter a global EMS market.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.