-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Avicena will Showcase the World’s Smallest 1Tbps Optical Transceiver at the SuperComputing Conference 2023 in Denver, CO
November 14, 2023 | AvicenaEstimated reading time: 2 minutes

Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating the world’s smallest 1Tbps optical transceiver as part its LightBundleTM multi-Tbps chip-to-chip interconnect technology at the SuperComputing Conference (SC23) in Denver, CO. Avicena’s microLED-based LightBundle architecture supports unprecedented throughput, shoreline density and low power, unlocking the performance of processors, memory, and sensors.
Artificial intelligence (AI) is driving an unprecedented surge in demand for compute and memory performance, driven by applications like ChatGPT based on large language models (LLMs). These sophisticated models have an insatiable appetite for computing power and fast access to large amounts of memory, resulting in an urgent and growing demand for much higher density low-power interconnects between Graphics Processing Units (GPUs) and high-bandwidth memory (HBM) modules. Today, HBM modules must be co-packaged with GPUs because the GPU-memory electrical interconnect is limited to just a few millimeters in length. Subsequent HBM generations will require IC shoreline densities in the range of 10Tbps/mm or more. Conventional optical interconnects based on VCSELs or Silicon Photonics (SiPh) promise to extend the interconnect reach but struggle to meet size, bandwidth density, power, latency, operating temperature, and cost requirements. By contrast, Avicena’s microLED-based LightBundle interconnects provide higher bandwidth density, much smaller size, much lower power and latency, and very low costs.
“At Avicena we are excited to showcase the world’s most compact 1Tbps transceiver in the shape of a 3mm x 4mm CMOS ASIC using our patented microLED optical interface,” says Bardia Pezeshki, Founder and CEO of Avicena. “Everyone is talking about SiPh solutions for applications in AI clusters. However, for short reach interconnects with less than 10m reach, we believe that our LED based solution is inherently better suited because the compact size, higher bandwidth density, lower power and latency, and temperature tolerance up to 150°C.”
Avicena’s innovations are supported by key investors including Samsung Catalyst Fund, Cerberus Capital Management, Clear Ventures, and Micron Ventures.
“Optical interconnect technology has the potential to improve chip-to-chip and inter-rack performance,” says Marco Chisari, head of the Samsung Semiconductor Innovation Center. “With a roadmap to multi-Tbps capacity and sub-pJ/bit power efficiency, Avicena’s innovative LightBundle interconnects can enable the next era of AI innovation, paving the way for even more capable models and a wide range of AI applications that will shape the future.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Indium to Showcase Sustainable Solder Paste and Alloy Technologies at Detroit Battery Show
10/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, automotive, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at The Battery Show North America, to be held October 7-9 in Detroit, Michigan.
Indium Features Next-Generation Materials for Semiconductor Assembly at IMAPS
09/29/2025 | Indium CorporationIndium Corporation, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.
Orbit International’s Power Group Receives Two Contract Awards Totaling Approximately $1,500,000
09/29/2025 | Globe NewswireOrbit International Corp., an electronics manufacturer and software solution provider, announced that its Power Group (OPG) received two contract awards totaling approximately $1,500,000.
Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025
09/25/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025.
Aismalibar North America Showcases Advanced Thermal Management Solutions at The Battery Show North America 2025
09/18/2025 | AismalibarAismalibar North America, a leader in high-performance thermal management solutions, will present its latest innovations at The Battery Show North America and Electric & Hybrid Vehicle Technology Expo 2025 in Detroit, Michigan, October 6–9, 2025, where attendees can meet the team at Booth #5929 to explore materials engineered for demanding EV and high-power electronics.